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QESM04
SMD 6.0x3.5 Crystal – Ceramic SMD packaged
Specification (rev-D)
September 01
th, 2006
3
TEMEX reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost.
Freque ncy
Item
Code
Dimension
Tolerance
Pitch of components
P
8.0
± 0.1
Pitch of sprocket hole
Po
4.0
± 0.1
Length from hole center to component center
P1
2.0
± 0.1
Width of carrier tape
W
16.0
± 0.3
Width of adhesive tape
W0
7.5
± 0.1
Height of component hole
A
7.1
± 0.1
Width of component hole
B
4.7
± 0.1
Gap of hold down tape and carrier tape
W2
1.75
± 0.1
Diameter of sprocket hole
Do
1.5
± 0.05
Diameter of feed hole
D1
1.5
± 0.25
Total of tape thickness
K
1.5
± 0.1
Tape Drawing
Reel Drawing
1.6
13.5
178
13.5
21.6
2.5
Multiple : 1Kpcs per Reel
Unit : mm