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參數(shù)資料
| 型號(hào)： | QSA |
| 廠商： | ITT Corporation |
| 英文描述： | Excellent tactile feel, SMT switch adapted for low current, Only actuate 1 direction at a time |
| 中文描述： | 出色的觸覺，表面貼裝開關(guān)低電流，只有開動(dòng)一次一方向調(diào)整 |
| 文件頁數(shù)： | 2/2頁 |
| 文件大?。?/td> | 227K |
| 代理商： | QSA |
3
0
2
±
0
5
9
0
1
0.8
2.54 2.54 2.54 2.54
K
1
1
9
2
0
1
2
±
0
17.6
±
0.2
15
1
5
1
16
5
3.5
±
0.05
2
(
M
K
M
M
pivotal point
type designation
deflection with F=4N
Z
3
2
4
1
K
K
F
Dimensions are shown: mm (inch)
Dimensions subject to change
www.ittcannon.com
C-2
N
C
QSA2S H1
QSA Series
1
(
1
9
2
1
5
5
1.6
5
2.54 2.542.542.54
0.8
2
0
15
1
1.
2
26
4
9
3
0
2
0
9
±
0
-
1
-
K
M
K
M
3.5
±
0.05
8.5
8.5
2
-0.05
pivotal point
type
designation
1
2
deflection with F= 4N
Z
F
QSA4S H1
1.
1.
2.
18
18
32
56
15
2.2
1.2
1.8
+01
1.2
+01
5
5
3
6
1
mounting side
K1
K2
M1,2
circuit diagram
PAD LAYOUT
14.6
3
15
14
2
18
+01
5
12
+01
5
1.2
3
1
1.8
2
1
12.6
2.54
2.54
2.54
2.54
mounting side
K1
K2
M1,2
K3
K4
M3,4
M3,4
circuit diagram
PAD LAYOUT
VIEW Z
VIEW Z
yellow surface:
terminals and top plate
fixations to be soldered
with Infrared process
bearing point -to keep
free from PCB lines
snap-in pges and
positioning pins to get
through the PCB but not
to be soldered
green surface:
red hole:
yellow surface:
terminals and top plate
fixations to be soldered
with Infrared process
bearing point -to keep
free from PCB lines
snap-in pges and
positioning pins to get
through the PCB but not
to be soldered
green surface:
red hole:
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