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| 型號(hào)： | QW050A1 |
| 英文描述： | Analog IC |
| 中文描述： | 模擬IC |
| 文件頁(yè)數(shù)： | 12/20頁(yè) |
| 文件大小： | 1272K |
| 代理商： | QW050A1 |
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QW050A1 and QW075A1 Power Modules:
dc-dc Converters; 36 to 75 Vdc Input, 5 Vdc Output; 50 W and 75 W
12
Lucent Technologies Inc.
Data Sheet
May 2000
Thermal Considerations
(continued)
Heat Transfer Without Heat Sinks
Increasing airflow over the module enhances the heat
transfer via convection. Figure 25 shows the maximum
power that can be dissipated by the module without
exceeding the maximum case temperature versus local
ambient temperature (T
A
) for natural convection
through 4 m/s (800 ft./min.).
Note that the natural convection condition was mea-
sured at 0.05 m/s to 0.1 m/s (10 ft./min. to 20 ft./min.);
however, systems in which these power modules may
be used typically generate natural convection airflow
rates of 0.3 m/s (60 ft./min.) due to other heat dissipat-
ing components in the system. The use of Figure 25 is
shown in the following example.
Example
What is the minimum airflow necessary for a QW050A1
operating at V
I
= 54 V, an output current of 10 A, and a
maximum ambient temperature of 40 °C
Solution
Given: V
I
= 54 V
= 10 A
A
= 40 °C
I
T
O
Determine P
D
(Use Figure 23.):
= 10 W
P
D
Determine airflow (v) (Use Figure 25.):
v = 1.25 m/s (250 ft./min.)
Note:
Pending improvement will lower the power dissi-
pation and reduce the airflow needed.
8-2957 (F)
Note: Pending improvement will lower the power dissipation.
Figure 23. QW050A1 Power Dissipation vs.
Output Current at 25 °C
8-2958 (F)
Note: Pending improvement will lower the power dissipation.
Figure 24. QW075A1 Power Dissipation vs.
Output Current at 25 °C
11
10
9
8
7
6
5
4
3
1
2
3
4
5
6
7
8
9
10
P
D
OUTPUT CURRENT, I
O
(A)
V
I
= 75 V
V
I
= 48 V
V
I
= 36 V
SEE NOTE
16
14
12
10
8
6
4
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15
OUTPUT CURRENT, I
O
(A)
P
D
V
I
= 75 V
V
I
= 54 V
V
I
= 36 V
SEE NOTE
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