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REV. C
–5–
REF02
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the REF02 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS*
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 V
Output Short-Circuit Duration
(to Ground or VIN) . . . . . . . . . . . . . . . . . . . . . . . . Indefinite
Storage Temperature Range
J, RC, and Z Packages . . . . . . . . . . . . . . . –65
∞C to +150∞C
P Package . . . . . . . . . . . . . . . . . . . . . . . . . –65
∞C to +125∞C
Operating Temperature Range
REF02A, REF02, REF02RC . . . . . . . . . . –55
∞C to +125∞C
REF02CJ, REF02CZ . . . . . . . . . . . . . . . . . . . . 0
∞C to 70∞C
REF02CP, REF02CS, REF02E,
REF02H . . . . . . . . . . . . . . . . . . . . . . . . . –40
∞C to +85∞C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . . 300
∞C
*Absolute maximum ratings apply to both DICE packaged parts, unless otherwise
noted.
Package Type
JA*
JC
Unit
TO-99 (J)
170
24
∞C/W
8-Lead Hermetic DIP (Z)
162
26
∞C/W
8-Lead Plastic DIP (P)
110
50
∞C/W
20-Contact LCC (RC, TC)
120
40
∞C/W
8-Lead SOIC (S)
160
44
∞C/W
20-Contact PLCC (PC)
80
39
∞C/W
* JA is specified for worst-case mounting conditions, i.e., JA is specified for device
in socket for TO, CERDIP, P-DIP, and LCC packages; JA is specified for device
soldered to printed circuit board for SO and PLCC packages.
ORDERING GUIDE
1
TA = 25
∞C
Package Description
Operating
VOS Max
Cerdip
Plastic
LCC
Temperature
(mV)
TO-99
8-Lead
20-Contact
Range
±15
REF02AZ
2
MIL
±15
REF02EJ
REF02EZ
XIND
±25
REF02J
2
REF02Z
2
REF02RC/883
MIL
±25
REF02HJ
REF02HZ
REF02HP
XIND
±50
REF02CJ
REF02CZ
COM
±50
REF02CP
XIND
±50
REF02CS
3
XIND
±100
REF02DP
COM
NOTES
1Burn-in is available on commercial and industrial temperature range parts in Cerdip, plastic DIP, and TO-can packages.
2For devices processed in total compliance to MIL-STD-883, add 883 after part number. Consult factory for 883 data sheet.
3For availability and burn-in information on SOIC and PLCC packages, contact your local sales office.