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參數(shù)資料
| 型號： | REG103FA-A |
| 元件分類： | 基準電壓源/電流源 |
| 英文描述： | Cap-Free, NMOS, 150mA Low Dropout Regulator with Reverse Current Protection |
| 中文描述： | 無電容，NMOS管，150mA的低壓差穩(wěn)壓器的反向電流保護 |
| 文件頁數(shù)： | 13/19頁 |
| 文件大?。?/td> | 502K |
| 代理商： | REG103FA-A |
REG103
SBVS010B
13
Power dissipation depends on input voltage and load condi-
tions. Power dissipation is equal to the product of the
average output current times the voltage across the output
element, V
IN
to V
OUT
voltage drop.
P
V
V
I
D
IN
OUT
OUT AVG
(
=
(
–
)
)
Power dissipation can be minimized by using the lowest
possible input voltage necessary to assure the required
output voltage.
REGULATOR MOUNTING
The tab of both packages is electrically connected to ground.
For best thermal performance, the tab of the DDPAK sur-
face-mount version should be soldered directly to a circuit-
board copper area. Increasing the copper area improves heat
dissipation. Figure 12 shows typical thermal resistance from
junction to ambient as a function of the copper area for the
DDPAK.
Although the tabs of the DDPAK and the SOT-223 are
electrically grounded, they are not intended to carry any
current. The copper pad that acts as a heat sink should be
isolated from the rest of the circuit to prevent current flow
through the device from the tab to the ground pin. Solder pad
footprint recommendations for the various REG103 devices
are presented in the Application Bulletin “Solder Pad Rec-
ommendations for Surface-Mount Devices” (SBFA015),
available from the Texas Instruments web site (www.ti.com).
FIGURE 12. Thermal Resistance versus PCB Area for the Five-Lead DDPAK.
FIGURE 13. Thermal Resistance versus PCB Area for the Five-Lead SOT-223.
50
40
30
20
10
0
0
1
2
3
4
5
Copper Area (Inches
2
)
REG103
Surface-Mount Package
1 oz. copper
Circuit-Board Copper Area
REG103
DDPAK Surface-Mount Package
THERMAL RESISTANCE vs PCB COPPER AREA
T
J
°
C
θ
THERMAL RESISTANCE vs PCB COPPER AREA
180
160
140
120
100
80
60
40
20
0
T
J
°
C
θ
0
1
2
3
4
5
Copper Area (Inches
2
)
Circuit-Board Copper Area
REG103
SOT-223 Surface-Mount Package
REG103
Surface-Mount Package
1 oz. copper
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| REG103FA-AKTTT | Cap-Free, NMOS, 150mA Low Dropout Regulator with Reverse Current Protection |
| REG103GA-2.5 | Cap-Free, NMOS, 150mA Low Dropout Regulator with Reverse Current Protection |
| REG103GA-2.7 | Cap-Free, NMOS, 150mA Low Dropout Regulator with Reverse Current Protection |
| REG103GA-3 | Cap-Free, NMOS, 150mA Low Dropout Regulator with Reverse Current Protection |
| REG103GA-3.3 | Cap-Free, NMOS, 150mA Low Dropout Regulator with Reverse Current Protection |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| REG103FA-A/500 | 功能描述:低壓差穩(wěn)壓器 - LDO DMOS 500mA LDO Reg RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| REG103FA-A/500E3 | 功能描述:低壓差穩(wěn)壓器 - LDO DMOS 500mA LDO Reg RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| REG103FA-A/500G3 | 功能描述:低壓差穩(wěn)壓器 - LDO DMOS 500mA LDO Reg RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| REG103FA-AKTTT | 功能描述:低壓差穩(wěn)壓器 - LDO DMOS 500mA LDO Reg RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| REG103FA-AKTTTG3 | 功能描述:低壓差穩(wěn)壓器 - LDO DMOS 500mA LDO Reg RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-20 |
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