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參數(shù)資料
| 型號(hào)： | REG113 |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | DMOS 400mA Low-Dropout Regulator(DMOS 400mA 低壓差穩(wěn)壓器) |
| 中文描述： | 的DMOS 400mA的低壓差穩(wěn)壓器（DMOS的400mA的低壓差穩(wěn)壓器） |
| 文件頁數(shù)： | 10/14頁 |
| 文件大?。?/td> | 247K |
| 代理商： | REG113 |
REG113
SBVS031C
10
www.ti.com
The internal protection circuitry of the REG113 is designed to
protect against overload conditions and is not intended to
replace proper heat sinking. Continuously running the REG113
into thermal shutdown will degrade reliability.
POWER DISSIPATION
The REG113 is available in two different package configura-
tions. The ability to remove heat from the die is different for each
package type and, therefore, presents different considerations
in the printed circuit-board layout. On the MSOP-8 package,
leads 5 through 8 are fused to the lead frame and may be used
to improve the thermal performance of the package. The PCB
area around the device that is free of other components moves
the heat from the device to the ambient air. Although it is difficult
or impossible to quantify all of the variables in a thermal design
of this type, performance data for several simplified configura-
tions are shown in Figure 6. In all cases the PCB copper area
is bare copper, free of solder resist mask, and not solder plated.
All examples are for 1-ounce copper and in the case of the
MSOP-8, the copper area is connected to fused leads 5 to 8.
See Figure 7 for thermal resistance for varying areas of
copper. Using heavier copper can increase the effectiveness in
removing the heat from the device. In those examples where
there is copper on both sides of the PCB, no connection has
been provided between the two sides. The addition of plated
through holes will improve the heat sink effectiveness.
For large step changes in load current, the REG113 requires
a larger voltage drop across it to avoid degraded transient
response. The boundary of this transient dropout region is
shown as the top line in Figure 5. Values of V
IN
to V
OUT
voltage
drop above this line insure normal transient response.
In the transient dropout region between DC and Transient,
transient response recovery time increases. The time required to
recover from a load transient is a function of both the magnitude
and rate of the step change in load current and the available
headroom V
IN
to V
OUT
voltage drop. Under worst-case condi-
tions (full-scale load change with (V
IN
–
V
OUT
) voltage drop close
to DC dropout levels), the REG113 can take several hundred
microseconds to re-enter the specified window of regulation.
TRANSIENT RESPONSE
The REG113 response to transient line and load conditions
improves at lower output voltages. The addition of a capacitor
(nominal value 0.47
μ
F) from the output pin to ground may
improve the transient response. In the adjustable version, the
addition of a capacitor, C
FB
(nominal value 10nF), from the
output to the adjust pin also improves the transient response.
THERMAL PROTECTION
Power dissipated within the REG113 can cause the junction
temperature to rise, however, the REG113 has thermal
shutdown circuitry that protects the regulator from damage.
The thermal protection circuitry disables the output when
the junction temperature reaches approximately 160
°
C,
allowing the device to cool. When the junction temperature
cools to approximately 140
°
C, the output circuitry is again
enabled. Depending on various conditions, the thermal
protection circuit can cycle on and off. This limits the
dissipation of the regulator, but can have an undesirable
effect on the load.
Any tendency to activate the thermal protection circuit indi-
cates excessive power dissipation or an inadequate heat sink.
For reliable operation, junction temperature should be limited
to 125
°
C, maximum. To estimate the margin of safety in a
complete design (including heat sink), increase the ambient
temperature until the thermal protection is triggered. Use
worst-case loads and signal conditions. For good reliability,
thermal protection should trigger more than 35
°
C above the
maximum expected ambient condition of the application. This
produces a worst-case junction temperature of 125
°
C at the
highest expected ambient temperature and worst-case load.
3.0
2.5
2.0
1.5
1.0
0.5
0
P
MAXIMUM POWER DISSIPATION vs TEMPERATURE
–
50
–
25
0
Ambient Temperature (
°
C)
25
50
75
100
125
Condition 1
Condition 2
Condition 3
CONDITION
1
2
3
PACKAGE
MSOP-8
MSOP-8
SOT-23-8
PCB AREA
1 sq. in. Cu, 1 Side
0.25 sq. in. Cu, 1 Side
None
THETA J-A
71
90
200
FIGURE 6. Maximum Power Dissipation versus Ambient Tem-
perature for the Various Packages and PCB Heat
Sink Configurations.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| REG113_07 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:DMOS 400mA Low-Dropout Regulator |
| REG113_08 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:DMOS 400mA Low-Dropout Regulator |
| REG113-25 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:DMOS 400mA Low-Dropout Regulator |
| REG113-285 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:DMOS 400mA Low-Dropout Regulator |
| REG113-3 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:DMOS 400mA Low-Dropout Regulator |
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