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參數(shù)資料
| 型號(hào)： | REG5601 |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | 18-Line SCSI Active Terminator(18線SCSI有源終端) |
| 中文描述： | 18線的SCSI主動(dòng)終結(jié)者（18線的SCSI有源終端） |
| 文件頁(yè)數(shù)： | 3/3頁(yè) |
| 文件大?。?/td> | 150K |
| 代理商： | REG5601 |
3
REG5601
4.7μF Tantalum
2.9V
T18
T1
Termpwr
REG5601
Regulator
Output
Disconnect
T18
T1
Termpwr
REG5601
Regulator
Output
Disconnect
SCSI
Cable
4.7μF Tantalum
+
4V to 5.25V
14
4.7μF Tantalum
+
4V to 5.25V
14
+
15
2
27
2
27
4.7μF
Tantalum
2.9V
+
15
0 = Termination On
1 = Disconnect
1
28
0 = Termination On
1 = Disconnect
1
Gnd
28
Gnd
(18 Lines)
(18 Lines)
(18 Lines)
To
Controller
Transceivers
To
Controller
Transceivers
FIGURE 1. Standard SCSI Termination Application.
θ
θ
θ
CIRCUIT BOARD
MATERIAL
JUNCTION TO LEAD
(
°
C/W)
+
BOARD TO AMBIENT
(
°
C/W)
=
JUNCTION TO AMBIENT
(
°
C/W)
PACKAGE
SO-28
1-Layer
(1)
3-Layer
(2)
Aluminum
(3)
20
20
20
+
+
+
30
21
12
=
=
=
50
41
32
SSOP-28
1-Layer
(1)
3-Layer
(2)
Aluminum
(3)
20
20
20
+
+
+
36
23
13
=
=
=
56
43
33
NOTES: (1) Single-side layout on 0.062 inch FR4, 1 oz copper. (2) Three-layer layout on 0.062 inch FR4, 1 oz copper.
(3) Aluminum 0.062 inch substrate, 0.003 insulation, one layer, 1 oz copper (Thermal Clad, Bergqueist Co.)
FIGURE 2. Circuit Board Layout.
The REG5601 has current limit and thermal shutdown that
protect it from damage during output short-circuit or overload.
The current limit is approximately 1350mA and thermal
shutdown activates at a junction temperature of approxi-
mately 175
°
C. For good reliability, the junction temperature
should not exceed 125
°
C. Any tendency to activate the
thermal shutdown during normal operation is an indication of
inadequate heat sinking and/or excessive power dissipation.
Heat is dissipated primarily by conduction through the leads
to circuit board traces. It is important to connect the six
thermal ground leads (7, 8, 9, 20, 21, 22) to a large circuit
trace—see Figure 2. Measured values of thermal resistance
for various circuit board materials are shown. These are
approximate values. Variations in circuit board pattern,
mounting techniques, air flow, proximity to other circuit
boards and heat sources will affect thermal performance.
A simple experiment will determine whether the actual circuit
board layout is adequate (i.e.,
θ
BA
is low enough) so that the
maximum recommended junction temperature of the REG5601
will not be exceeded. The procedure uses the internal thermal
shutdown feature of the REG5601 (at T
J
≈
175
°
C) to deter-
mine when the junction is approximately 50
°
C above the
maximum recommended junction temperature (T
J
= 125
°
C).
Operate the circuit with normal or other desired test electrical
conditions. Increase the ambient temperature and determine
the value at which thermal limit occurs (by sensing a sudden
drop in V
REG
output). At this point T
J
is approximately 175
°
C.
If this occurs at an ambient temperature of more than 50
°
C
above the system ambient temperature design goal, the T
J
will
not exceed 125
°
C under the same electrical conditions when
the ambient temperature is at the system design goal value.
T
J
= T
A
+ P
D
θ
JA
Thermal ground (leads 7, 8, 9, 20, 21, 22).
Connect to circuit ground or leave open-circuit.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| REG5601E | 制造商:BB 制造商全稱:BB 功能描述:18-LINE SCSI ACTIVE TERMINATOR |
| REG5601U | 制造商:BB 制造商全稱:BB 功能描述:18-LINE SCSI ACTIVE TERMINATOR |
| REG5608 | 制造商:BB 制造商全稱:BB 功能描述:LOW CAPACITANCE 18-Line SCSI ACTIVE TERMINATOR |
| REG5608E | 制造商:BB 制造商全稱:BB 功能描述:LOW CAPACITANCE 18-Line SCSI ACTIVE TERMINATOR |
| REG5608U | 制造商:BB 制造商全稱:BB 功能描述:LOW CAPACITANCE 18-Line SCSI ACTIVE TERMINATOR |
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