![](http://datasheet.mmic.net.cn/390000/RF2938_datasheet_16830080/RF2938_2.png)
2-2
RF2938
Rev A8 010418
11
T
Absolute Maximum Ratings
Parameter
Supply Voltage
Control Voltages
Input RF Level
LO Input Levels
Operating Ambient Temperature
Storage Temperature
Moisture Sensitivity
Rating
-0.5 to +3.6
-0.5 to +3.6
+12
+5
-40 to +85
-40 to +150
Unit
V
DC
V
DC
dBm
dBm
°C
°C
JEDEC Level 5 @ 220°C
Parameter
Specification
Typ.
Unit
Condition
Min.
Max.
Overall Receiver
T=25°C, V
CC
=3.3V, Freq=280MHz,
R
BW
=10k
RX Frequency Range
Cascaded Voltage Gain
Cascaded Noise Figure
Cascaded Input IP
3
Cascaded Input IP
3
RSSI Dynamic Range
RSSI Output Voltage Compli-
ance
45
500
MHz
dB
dB
dB
μ
V
dB
μ
V
dB
V
8 to 93
5
30
105
60
1.1 to 2.3
Dependent upon RX VGC
At maximum gain.
V
GC
<1.2V
V
GC
>2.0V
At V
GC
=1.4V
Maximum RSSI is 2.5V or V
CC
-0.3, which-
ever is less. V
GC
=1.4V
f=280MHz, LO Power=-10dBm
With expected LO amplitude and harmonic
content. R1=270k
.
Q>I
IF LO Leakage
Quadrature Phase Variation
-68
±2
dBm
°
±5
Quadrature Amplitude Offset
Quadrature Amplitude Variation
IF AMP and Quad Demod
Gain Control Range
Noise Figure
IF Input Impedance
+0.25
±0.25
dB
dB
+0.5
43
5
dB
dB
dBm
dBm
VGC <1.2V max gain, VGC>2.0V=min gain
Single Sideband
Single ended. 280MHz
Single ended. 374MHz
V
GC
<1.2V
V
GC
>2.0V
230-j400
75-j350
-68
-8
Input IP
3
RX Baseband Amplifiers
THD
3
3
%
%
dB
At maximum gain setting
At minimum gain setting
V
GC
<1.2V=max gain,
V
GC
>2.0V=min gain
R
L
>5k
, C
L
<5pF
Gain Control Range
30
Output Voltage
DC Output Voltage
RX Baseband Filters
Baseband Filter 3dB Bandwidth
Passband Ripple
Baseband Filter 3dB Frequency
Accuracy
Group Delay
500
1.7
mV
PP
V
1
35
0.1
±30
MHz
dB
%
5th order Bessel LPF. Set by BW CTRL
±10
15
ns
At 35MHz, increasing as bandwidth
decreases.
At 2MHz.
Group Delay
Baseband Filter Ultimate Rejec-
tion
Output Impedance
400
>80
ns
dB
20
Designed to drive>5k
, <5pF load.
Caution!
ESD sensitive device.
RF Micro Devices believes the furnished information is correct and accurate
at the time of this printing. However, RF Micro Devices reserves the right to
make changes to its products without notice. RF Micro Devices does not
assume responsibility for the use of the described product(s).
Refer to “Handling of PSOP and PSSOP Products” on page 16-15 for
special handling information.
Refer to “Soldering Specifications” on page 16-13 for special solder-
ing information.