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參數(shù)資料
| 型號(hào)： | RFBPF3225150F6-G |
| 英文描述： | 2450 MHz, CERAMIC BPF |
| 文件頁數(shù)： | 3/7頁 |
| 文件大小： | 474K |
| 代理商： | RFBPF3225150F6-G |
Page 3 of 7
AS_2.4GHz 3225BPF_A0_05
Sep.-2001
SOLDER LAND PATTERN
Figure
Symbol
Dimension (mm)
L
3.40
±
0.10
A
1.50
±
0.10
B
1.20
±
0.10
L1
2.80
±
0.10
A1
0.30
±
0.10
B1
0.90
±
0.10
W1
0.60
±
0.10
W2
0.50
±
0.10
Line width to be design to match 50
W
characteristic impedance,
depending on PCB material and thickness.
ELECTRICAL CHARACTERISTICS
n
RFBPF3225150A0x Series
Φ
0.40
±
0.10
Item
Specification
Frequency range (MHz)
2450
±
50 MHz
Insertion Loss
2.5 dB (max)
VSWR
1.7
Ripple
0.6 dB
Attenuation (min.)
40 dB @ 1500 MHz ~ 1550 MHz
45 dB @ 1800 MHz ~ 1900 MHz
30 dB @ 2100 MHz
15 dB @ 2200 MHz
30 dB @ 4800 ~ 5000 MHz
*Note1: Rated power 5W MAX
*Note2: Maximum Input power: 10W for 5 minutes
I/O Solder Pad
Ground Solder Pad
Ground Via
L
W2
W1
B1
A1
L1
B
A
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| RFBPF3225150F6-B | 2450 MHz, CERAMIC BPF |
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| RFBPF3225150F5-T | 2450 MHz, CERAMIC BPF |
| RFBPF3225150F5-G | 2450 MHz, CERAMIC BPF |
| RFBPF3225150F5-B | 2450 MHz, CERAMIC BPF |
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