參數(shù)資料
型號: RGP25M
廠商: GE Security, Inc.
英文描述: GLASS PASSIVATED JUNCTION FAST SWITCHING RECTIFIER
中文描述: 玻璃鈍化結(jié)快速開關(guān)整流器
文件頁數(shù): 1/2頁
文件大?。?/td> 59K
代理商: RGP25M
RGP25A THRU RGP25M
GLASS PASSIVATED JUNCTION FAST SWITCHING RECTIFIER
Reverse Voltage -
50 to 1000 Volts
Forward Current -
2.5 Amperes
FEATURES
Plastic package has
Underwriters Laboratory
Flammability Classification 94V-0
High temperature metallurgically bonded construction
Glass passivated cavity-free junction
2.5 Ampere operation at T
A
=55°C with no thermal
runaway
Typical I
R
less than 0.2
μ
A
Capable of meeting environmental standards of
MIL-S-19500
Fast switching for high efficiency
High temperature soldering guaranteed:
350°C/10 seconds, 0.375" (9.5mm) lead length,
5 lbs. (2.3kg) tension
MECHANICAL DATA
Case:
JEDEC DO-201AD molded plastic over glass body
Terminals:
Plated axial leads, solderable per MIL-STD-750,
Method 2026
Polarity:
Color band denotes cathode end
Mounting Position:
Any
Weight:
0.04 ounce, 1.12 grams
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
RGP
25A
RGP
25B
RGP
25D
RGP
25G
RGP
25J
RGP
25K
RGP
25M
SYMBOLS
UNITS
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
0.375" (9.5mm) lead length at T
A
=55°C
Peak forward surge current 8.3ms single half sine-
wave superimposed on rated load (JEDEC Method)
Maximum instantaneous forward voltage at 2.5A
Maximum DC reverse current
at rated DC blocking voltage
Maximum full load reverse current, full cycle average
0.375" (9.5mm) lead length at T
A
=55°C
Maximum reverse recovery time
(NOTE 1)
Typical junction capacitance
(NOTE 2)
Typical thermal resistance
(NOTE 3)
Operating junction and storage temperature range
V
RRM
V
RMS
V
DC
50
35
50
100
70
100
200
140
200
400
280
400
600
420
600
800
560
800
1000
700
1000
Volts
Volts
Volts
I
(AV)
2.5
Amps
I
FSM
100.0
Amps
V
F
1.3
5.0
200.0
Volts
T
A
=25°C
T
A
=125°C
I
R
μ
A
I
R
100.0
μ
A
t
rr
C
J
R
Θ
JA
T
J
, T
STG
150
250
500
ns
pF
°C/W
°C
60.0
20.0
-65 to +175
NOTES:
(1) Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
(2) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead length, P.C.B. mounted
4/98
0.210 (5.3)
0DIA.
0.052 (1.32)
0.048 (1.22)
DIA.
1.0 (25.4)
MIN.
0.375 (9.5)
0.285 (7.2)
1.0 (25.4)
MIN.
DO-201AD
Dimensions in inches and (millimeters)
*
Glass-plastic encapsulation technique is covered by
Patent No. 3,996,602 and brazed-lead assembly by Patent No 3,930,306
PATENTED*
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