參數(shù)資料
型號(hào)： RHF-24(2)
廠商： Texas Instruments, Inc.
英文描述： LOW-POWER DISSIPATION ADSL LINE DRIVER
中文描述： 低功耗ADSL線路驅(qū)動(dòng)器
文件頁數(shù)： 2/30頁
文件大?。?/td> 1105K
代理商： RHF-24(2)
www.ti.com
PACKAGE DISSIPATION RATINGS
(1)
RECOMMENDED OPERATING CONDITIONS
THS6182
SLLS544G–SEPTEMBER 2002–REVISED NOVEMBER 2004
These devices have limited built-in ESD protection. The leads should be shorted together or the device
placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
PRODUCT
PACKAGE
PACKAGE CODE
SYMBOL
ORDER NUMBER
TRANSPORT MEDIA
Tape and reel
(3000 devices)
Tape and reel
(250 devices)
Tube (40 devices)
Tape and reel
(2500 devices)
Tube (25 devices)
Tape and reel
(2000 devices)
Tube (25 devices)
Tape and reel
(2000 devices)
THS6182RHFR
Leadless 24-pin
4, mm x 5, mm PowerPAD
THS6182RHF
RHF-24
6182
THS6182RHFT
THS6182D
THS6182D
SOIC-16
D-16
THS6182
THS6832DR
THS6182DW
THS6182DW
SOIC-20
DW-20
THS6182
THS6182DWR
THS6182DWP
THS6182DWP
SOIC-20 PowerPAD
DWP-20
THS6182
THS6182DWPR
PowerPAD SOLDERED
(2)
θ
JA
32
°
C/W
--
--
21.5
°
C/W
PowerPAD NOT SOLDERED
(3)
θ
JC
74
°
C/W
62.9
°
C/W
45.4
°
C/W
43.9
°
C/W
PACKAGE
θ
JC
RHF-24
(2)
D-16
DW-20
DWP-20
(2)
1.7
°
C/W
25.7
°
C/W
16.4
°
C/W
0.37
°
C/W
(1)
(2)
θ
values shown are typical for standard test PCBs only.
For high-power dissipation applications, use of the PowerPAD package with the PowerPad on the underside of the chip. This acts as a
heatsink and must be connected to a thermally dissipating plane for proper dissipation. Failure to do so may result in exceeding the
maximum junction temperature which could permanently damage and/or reduce the lifetime the device. See TI technical brief SLMA002
for more information about utilizing the PowerPAD thermally enhanced package.
Use of packages without the PowerPAD or not soldering the PowerPAD to the PCB, should be limited to low-power dissipation
applications.
(3)
MIN NOM
±
5
10
MAX UNIT
±
15
30
Dual supply
Single supply
±
12
24
V
CC+
to V
CC-
Supply voltage
V
2
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