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參數(shù)資料
| 型號(hào)： | RM4558D |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | N-Channel MOSFETs (>500V…900V); Package: PG-TO247-3; V<sub>DS</sub> (max): 800.0 V; Package: TO-247; R<sub>DS(ON)</sub> @ T<sub>J</sub>=25°C V<sub>GS</sub>=10: 290.0 mOhm; I<sub>D(max)</sub> @ T<sub>C</sub>=25°C: 17.0 A; I<sub>Dpuls</sub> (max): 51.0 A; |
| 中文描述： | 雙通用運(yùn)算放大器 |
| 文件頁(yè)數(shù)： | 4/11頁(yè) |
| 文件大小： | 303K |
| 代理商： | RM4558D |
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
SOIC
Package
Drawing
D
Pins Package
Qty
75
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
RC4558D
ACTIVE
8
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-2-260C-1YEAR
RC4558DGKR
ACTIVE
MSOP
DGK
8
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
75
Pb-Free
(RoHS)
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
50
Pb-Free
(RoHS)
150
Pb-Free
(RoHS)
2000
Pb-Free
(RoHS)
50
Pb-Free
(RoHS)
CU NIPDAU
RC4558DR
ACTIVE
SOIC
D
8
CU NIPDAU
Level-1-260C-UNLIM
RC4558ID
ACTIVE
SOIC
D
8
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-2-260C-1YEAR
RC4558IDGKR
ACTIVE
MSOP
DGK
8
CU NIPDAU
RC4558IDR
ACTIVE
SOIC
D
8
CU NIPDAU
Level-1-260C-UNLIM
RC4558IP
ACTIVE
PDIP
P
8
CU NIPDAU
Level-NC-NC-NC
RC4558IPW
ACTIVE
TSSOP
PW
8
CU NIPDAU
Level-1-250C-UNLIM
RC4558IPWR
ACTIVE
TSSOP
PW
8
CU NIPDAU
Level-1-250C-UNLIM
RC4558P
ACTIVE
PDIP
P
8
CU NIPDAU
Level-NC-NC-NC
RC4558PSLE
RC4558PSR
OBSOLETE
ACTIVE
SO
SO
PS
PS
8
8
None
Pb-Free
(RoHS)
Pb-Free
(RoHS)
None
Pb-Free
(RoHS)
None
Call TI
CU NIPDAU
Call TI
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-1-250C-UNLIM
2000
RC4558PW
ACTIVE
TSSOP
PW
8
150
CU NIPDAU
RC4558PWLE
RC4558PWR
OBSOLETE
ACTIVE
TSSOP
TSSOP
PW
PW
8
8
Call TI
CU NIPDAU
Call TI
Level-1-250C-UNLIM
2000
RC4558Y
OBSOLETE
XCEPT
Y
0
Call TI
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check
for the latest availability information and additionalproduct content details.
None:
Not yet available Lead (Pb-Free).
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
PACKAGE OPTION ADDENDUM
www.ti.com
18-Feb-2005
Addendum-Page 1
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