RM807
Package Dimensions and Pin Description
Power Amplifier Module for TDMA PCS (1850–1910 MHz)
100409F
February 7, 2002
Skyworks
9
Package Dimensions and Pin Description
The RM807 is a multi-layer laminate base, overmold encapsulated modular package designed for
surface mount solder attachment to a printed circuit board.
Figure 8. RM807 Package Drawing
100409_002
1
2
3
(PIN 7)
R .500 TYP
6
5
4
5.92/6.15
2.870 (2x)
1.981 (2x)
1.219 (2x)
1.500 TYP
5.92/6.15
.762 6x
2.500
(4x)
- TOP VIEWS -
2
3
6
5
4
PIN 1
INDICATOR
FRONT VIEW
NOTE:
Solder mask pattern pad layout as seen
from top looking through package.
All dimensions in millimeters.
Table 5. Pin Description
Pin #
Function
1
VCC1
(1)
2
RF Input
3
VREF
4
VCC2
(1)
5
RF Output
6
GND
(7) GND PAD
GND
(2)
NOTE(S):
(1)
All supply pins may be connected together at the supply.
(2)
Package underside is GND.
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