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參數(shù)資料
| 型號(hào)： | RT9701CBL |
| 廠商： | Electronic Theatre Controls, Inc. |
| 元件分類(lèi)： | 基準(zhǔn)電壓源/電流源 |
| 英文描述： | 100m POWER DISTRIBUTION SWITCHES |
| 中文描述： | 百米配電開(kāi)關(guān) |
| 文件頁(yè)數(shù)： | 10/12頁(yè) |
| 文件大?。?/td> | 306K |
| 代理商： | RT9701CBL |
RT9701
www.richtek-ic.com.tw
10
DS9701-05 October 2001
Applications Information
Filtering
To limit the input voltage drop during hot-plug events,
connect a 1μF ceramic capacitor from VIN to GND.
However, higher capacitor values will further reduce
the voltage drop at the input.
Connect a sufficient capacitor from VOUT to GND.
This capacitor helps to prevent inductive parasitics
from pulling VOUT negative during turn-off or EMI
damage to other components during the hot-
detachment. It is also necessary for meeting the USB
specification during hot plug-in operation. If RT9701
is implanted in device end application, minimum 1
μ
F
capacitor from VOUT to GND is recommended and
higher capacitor values are also preferred.
In choosing these capacitors, special attention must
be paid to the Effective Series Resistance, ESR, of
the capacitors to minimize the IR drop across the
capacitor’s ESR. A lower ESR on this capacitor can
get a lower IR drop during the operation.
Ferrite beads in series with all power and ground
lines are recommended to eliminate or significantly
reduce EMI. In selecting a ferrite bead, the DC
resistance of the wire used must be kept to a
minimum to reduce the voltage drop.
Reverse current preventing
The output MOSFET and driver circuitry are also
designed to allow the MOSFET source to be
externally forced to a higher voltage than the drain
(VOUT > VIN
≥
0). To prevent reverse current from
such condition, disable the switch (RT9701CB) or
connect VIN to a fixed voltage under 1.3V.
Layout and Thermal Dissipation
z
Place the switch as close to the USB connector as
possible. Keep all traces as short as possible to
reduce
the
effect
of
inductance.
undesirable
parasitic
z
Place the output capacitor and ferrite beads as
close to the USB connector as possible.
z
If ferrite beads are used, use wires with minimum
resistance and large solder pads to minimize
connection resistance.
z
If the package is with dual VOUT or VIN pins,
short both the same function pins as Fig.1 or Fig.2
to reduce the internal turn-on resistance. If the
output power will be delivered to two individual
ports, it is specially necessary to short both VOUT
pin at the switch output side in order to protect the
switch when each port are plug-in separately.
z
Under normal operating conditions, the package
can dissipate the channel heat away. Wide power-
bus planes connected to VIN and VOUT and a
ground plane in contact with the device will help
dissipate additional heat.
Fig. 1 High Side Power Switch
C
IN
= 1
μ
F, C
OUT
= 470
μ
F (Low ESR) on M/B
C
IN
= 1
μ
F, C
OUT
= 330
μ
F (Low ESR) on Notebook
C
IN
= 10
μ
F, C
OUT
= 1
μ
F on USB device
V
OUT2
RT9701CBL
VOUT
C
OUT
VIN
V
IN
C
IN
1
μ
F
GND
VOUT
VIN
V
OUT1
C
OUT
Fig. 2 High Side Power Switch with Chip Enable Control
V
OUT1
RT9701CB
VOUT
C
OUT
VIN
V
IN
C
IN
GND
OFF
ON
CE
V
CE
VOUT
V
OUT2
C
OUT
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