參數(shù)資料
型號(hào): S12SPIV2D
廠商: Motorola, Inc.
英文描述: MC9S12DT128 Device User Guide V02.09
中文描述: MC9S12DT128設(shè)備的用戶手冊(cè)V02.09
文件頁數(shù): 103/138頁
文件大小: 2083K
代理商: S12SPIV2D
MC9S12DT128 Device User Guide — V02.09
103
A.1.9 I/O Characteristics
This section describes the characteristics of all 5V I/O pins. All parameters are not always applicable, e.g.
not all pins feature pull up/down resistances.
Table A-5 Thermal Package Characteristics
1
NOTES
:
1. The values for thermal resistance are achieved by package simulations
2. PC Board according to EIA/JEDEC Standard 51-3
3. PC Board according to EIA/JEDEC Standard 51-7
Num C
Rating
Symbol
Min
Typ
Max
Unit
1
T Thermal Resistance LQFP112, single sided PCB
2
θ
JA
54
o
C/W
2
T
Thermal Resistance LQFP112, double sided PCB
with 2 internal planes
3
θ
JA
41
o
C/W
3
T Junction to Board LQFP112
θ
JB
31
o
C/W
4
T Junction to Case LQFP112
θ
JC
11
o
C/W
5
T Junction to Package Top LQFP112
Ψ
JT
2
o
C/W
6
T Thermal Resistance QFP 80, single sided PCB
θ
JA
51
o
C/W
7
T
Thermal Resistance QFP 80, double sided PCB with
2 internal planes
θ
JA
41
o
C/W
8
T Junction to Board QFP80
θ
JB
27
o
C/W
9
T Junction to Case QFP80
θ
JC
14
o
C/W
10
T Junction to Package Top QFP80
Ψ
JT
3
o
C/W
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