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參數(shù)資料
| 型號： | S1PD |
| 廠商： | Vishay Intertechnology,Inc. |
| 英文描述： | High Current Density Surface Mount Glass-Passivated Rectifiers |
| 中文描述： | 高電流密度表面安裝玻璃鈍化整流器 |
| 文件頁數(shù)： | 1/2頁 |
| 文件大?。?/td> | 153K |
| 代理商： | S1PD |
0.000 (0.00)
0.012 (0.30)
0.013 (0.35)
0.004 (0.10)
0.018 (0.45)
0.006 (0.15)
0.045 (1.15)
0.033 (0.85)
0.036 (0.91)
0.024 (0.61)
0.016 (0.40)
0.032 (0.80)
0.053 (1.35)
0.041 (1.05)
0.012 (0.30) REF
0.105
(2.67)
0.025
(0.635)
0.100
(2.54)
0.030
(0.762)
0.050
(1.27)
Cathode band
0.142 (3.61)
0.126 (3.19)
0.158 (4.00)
0.146 (3.70)
0.086 (2.18)
0.074 (1.88)
0.087 (2.20)
0.103 (2.60)
Dimensions in inches
and (millimeters)
Case Style SMP
Maximum Ratings & Thermal Characteristics
Ratings at 25°C ambient temperature unless otherwise specified.
Parameter
Symbol
Device marking code
Maximum reverse voltage
V
RM
Maximum average forward rectified current Fig.1
I
F(AV)
Peak forward surge current 10ms single half sine-wave
superimposed on rated load
R
θ
JA
R
θ
JL
R
θ
JC
Operating junction temperature
T
J
,
Storage temperature
T
STG
S1PA
SA
50
S1PB
SB
100
S1PD
SD
200
1
S1PG
SG
400
S1PJ
SJ
600
Unit
V
A
I
FSM
30
A
Typical thermal resistance
(1)
105
15
20
150
°C/W
°C
°C
–55 to +150
Electrical Characteristics
Ratings at 25°C ambient temperature unless otherwise specified.
Parameter
Maximum instantaneous forward voltage
(2)
at I
F
=1A, T
J
=25°C
at I
F
=1A, T
J
=125°C
Maximum reverse current T
J
= 25°C
at rated VR
(2)
T
J
=125°C
Typical reverse recovery time at
at I
F
= 0.5A, I
R
= 1.0A, I
rr
= 0.25A
Typical junction capacitance at 4.0V, 1MHz
Notes
: (1) Thermal resistance from junction to ambient and junction to lead mounted on P.C.B. with 5.0 x 5.0mm copper pad areas. R
θ
JL
is measured at the ter-
minal of cathode band. R
θ
JC
is measured at the top centre of the body
(2) Pulse test: 300μs pulse width, 1% duty cycle
Symbol
Value
1.1
0.95
1.0
50
Unit
V
F
V
μA
I
R
trr
1.8
μs
C
J
6.0
pF
Features
Very low profile - typical height of 1.0mm
Ideal for automated placement
Glass passivated chip junction
For use in rectification, power supply, home appliances
and telecommunication
High temperature soldering:
260°C maximum/10 seconds at terminals
Meets MSL level 1 per J-STD-020C
Mechanical Data
Case:
SMP
Terminals:
Matte Tin plated (E3 Suffix) leads, solderable
per J-STD-002B and MIL-STD-750, Method 2026
Polarity:
Color band denotes cathode end
Weight:
0.0009 oz., 0.024 g
Epoxy meets UL 94V-0 flammability rating
Mounting Pad Layout
S1PA thru S1PJ
Vishay Semiconductors
formerly General Semiconductor
High Current Density Surface Mount
Glass-Passivated Rectifiers
Reverse Voltage
50 to 600 V
Forward Current
1.0 A
Document Number 88917
23-Sep-04
www.vishay.com
1
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