參數(shù)資料
型號: S29AL016M10FFI012
廠商: SPANSION LLC
元件分類: PROM
英文描述: 16 MEGABIT (2M X 8 BIT / I M X 16 BIT) 3.0 VOLT ONLY BOOT SECTOR FLASH MEMORY
中文描述: 1M X 16 FLASH 3V PROM, 100 ns, PBGA64
封裝: 13 X 11 MM, LEAD FREE, FBGA-64
文件頁數(shù): 51/62頁
文件大?。?/td> 1850K
代理商: S29AL016M10FFI012
October 11, 2006 S29AL016M_00_A7
S29AL016M
53
Data
Sheet
Erase and Programming Performance
Notes:
1. Typical program and erase times assume the following conditions: 25
°C, VCC = 3.0 V, 10,000 cycles, checkerboard data
pattern.
2. Under worst case conditions of 90°C, VCC = 2.7 V, 100,000 cycles.
3. The typical chip programming time is considerably less than the maximum chip programming time listed, since most bytes
program faster than the maximum program times listed.
4. In the pre-programming step of the Embedded Erase algorithm, all bytes are programmed to 00h before erasure.
5. System-level overhead is the time required to execute the two- or four-bus-cycle sequence for the program command. See
Tables 23 for further information on command definitions.
TSOP Pin and BGA Package Capacitance
Notes:
1. Sampled, not 100% tested.
2. Test conditions TA = 25°C, f = 1.0 MHz.
Parameter
Typ (Note 1)
Max (Note 2)
Unit
Comments
Sector Erase Time
0.7
7.5
s
Excludes 00h programming
prior to erasure (Note 4)
Chip Erase Time
32
s
Byte Programming Time
18
s
Word Programming Time
18
s
Excludes system level
overhead (Note 5)
Chip Programming Time
(Note 3)
Byte Mode
36
s
Word Mode
19
s
Parameter Symbol
Parameter Description
Test Setup
Typ
Max
Unit
CIN
Input Capacitance
VIN = 0
TSOP
6
7.5
pF
BGA
4.2
5.0
pF
COUT
Output Capacitance
VOUT = 0
TSOP
8.5
12
pF
BGA
5.4
6.5
pF
CIN2
Control Pin Capacitance
VIN = 0
TSOP
7.5
9
pF
BGA
3.9
4.7
pF
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