- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄225140 > S29CD032G0RQFI012 (SPANSION LLC) 1M X 32 FLASH 2.7V PROM, 48 ns, PQFP80 PDF資料下載
參數(shù)資料
| 型號： | S29CD032G0RQFI012 |
| 廠商： | SPANSION LLC |
| 元件分類： | PROM |
| 英文描述： | 1M X 32 FLASH 2.7V PROM, 48 ns, PQFP80 |
| 封裝： | LEAD FREE, PLASTIC, MO-108CB-1, QFP-80 |
| 文件頁數(shù)： | 9/81頁 |
| 文件大?。?/td> | 1276K |
| 代理商： | S29CD032G0RQFI012 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁當前第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁
March 3, 2009 S29CD-G_00_B1
S29CD-G Flash Family
15
Da ta
Shee t
(Prelim i nar y )
8.
Physical Dimensions - LAA080–80-ball Fortified Ball Grid Array (13 x 11
mm)
3214\38.12C
PACKAGE
LAA 080
JEDEC
N/A
13.00 x 11.00 mm
NOTE
PACKAGE
SYMBOL
MIN
NOM
MAX
A
--
1.40
PROFILE HEIGHT
A1
0.40
--
STANDOFF
A2
0.60
--
BODY THICKNESS
D
13.00 BSC.
BODY SIZE
E
11.00 BSC.
BODY SIZE
D1
9.00 BSC.
MATRIX FOOTPRINT
E1
7.00 BSC.
MATRIX FOOTPRINT
MD
10
MATRIX SIZE D DIRECTION
ME
8
MATRIX SIZE E DIRECTION
N
80
BALL COUNT
φb
0.50
0.60
0.70
BALL DIAMETER
eD
1.00 BSC.
BALL PITCH - D DIRECTION
eE
1.00 BSC.
BALL PITCH - E DIRECTION
SD/SE
0.50 BSC
SOLDER BALL PLACEMENT
NOTES:
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010
(EXCEPT AS NOTED).
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE "D"
DIRECTION. SYMBOL "ME" IS THE BALL COLUMN MATRIX
SIZE IN THE "E" DIRECTION. N IS THE TOTAL NUMBER OF
SOLDER BALLS.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW. WHEN THERE IS AN ODD NUMBER
OF SOLDER BALLS IN THE OUTER ROW PARALLEL TO THE D
OR E DIMENSION, RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW , SD OR SE = e/2
8.
N/A
9.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
BOTTOM VIEW
SIDE VIEW
TOP VIEW
2X
C
0.20
C
0.20
6
7
A
C
φ0.10
φ0.25 M
M
B
C
0.25
0.15 C
A
B
C
SEATING PLANE
J
K
eD
(INK OR LASER)
CORNER
A1
A2
D
E
φ0.50
A1 CORNER ID.
1.00±0.5
A
A1
CORNER
A1
NX
φb
SD
SE
eE
E1
D1
1
2
3
4
5
6
7
8
A
CB
D
FE
G
H
相關PDF資料 |
PDF描述 |
|---|---|
| S29CL032J0JFAM020 | 1M X 32 FLASH 3.3V PROM, 54 ns, PBGA80 |
| S29CL032J0JFFM020 | 1M X 32 FLASH 3.3V PROM, 54 ns, PBGA80 |
| S29CL032J0RFAM012 | 1M X 32 FLASH 3.3V PROM, 48 ns, PBGA80 |
| S29GL032A10TAIR11 | Ceramic Chip Capacitors / High Voltage; Capacitance [nom]: 3.3pF; Working Voltage (Vdc)[max]: 500V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 0805; Termination: Solder (SnPb) Plated Nickel Barrier; Body Dimensions: 0.079" x 0.049"; Container: Bulk; Features: High Voltage; Unmarked |
| S29GL032A10TAIR21 | 64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| S29CD032J0MQAN010 | 制造商:Spansion 功能描述: |
| S29CD032J0MQFM010U | 制造商:Spansion 功能描述:N/A - Trays |
| S29CD032J0PFAM010 | 制造商:Spansion 功能描述: |
| S29CD032J0PQFI010 | 制造商:Spansion 功能描述:AUTO 3.3V 512KX32 FLASH - Trays |
| S29CL016J0JQFM030 | 制造商:Spansion 功能描述:FLASH PARALLEL 3.3V 16MBIT 512KX32 54NS 80PQFP - Trays |
發(fā)布緊急采購，3分鐘左右您將得到回復。