參數(shù)資料
型號(hào): S29CL032J0RFAM012
廠商: SPANSION LLC
元件分類: PROM
英文描述: 1M X 32 FLASH 3.3V PROM, 48 ns, PBGA80
封裝: 13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-80
文件頁數(shù): 56/79頁
文件大小: 2994K
代理商: S29CL032J0RFAM012
6
S29CD-J & S29CL-J Flash Family
S29CD-J_CL-J_00_B3 March 30, 2009
Da ta
Sh e e t
Figures
ICC1 Current vs. Time (Showing Active and Automatic Sleep Currents) . . . . . . . . . . . . . . . . 53
Typical ICC1 vs. Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
VCC and VIO Power-up Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
相關(guān)PDF資料
PDF描述
S29GL032A10TAIR11 Ceramic Chip Capacitors / High Voltage; Capacitance [nom]: 3.3pF; Working Voltage (Vdc)[max]: 500V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 0805; Termination: Solder (SnPb) Plated Nickel Barrier; Body Dimensions: 0.079" x 0.049"; Container: Bulk; Features: High Voltage; Unmarked
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