參數(shù)資料
型號: S29GL032M10BFIR32
廠商: SPANSION LLC
元件分類: PROM
英文描述: T528 Series - I, M, Z Case Sizes - Face Down Termination Tantalum Surface Mount Capacitor; Capacitance [nom]: 330uF; Working Voltage (Vdc)[max]: 4V; Capacitance Tolerance: +/-20%; Dielectric: Tantalum, Solid; ESR: 9.0mΩ; Lead Style: Surface-Mount Chip; Lead Dimensions: 7343-17; Termination: 100% Tin (Sn); Body Dimensions: 7.3mm x 4.3mm x 1.7mm; Temperature Range: -55C to +105C; Container: Tape & Reel; Qty per Container: 1,000; Features: Face Down Termination
中文描述: 2M X 16 FLASH 3V PROM, 100 ns, PBGA48
封裝: 8 X 9 MM, LEAD FREE, FBGA-48
文件頁數(shù): 31/116頁
文件大?。?/td> 6024K
代理商: S29GL032M10BFIR32
February 7, 2007 S29GL-M_00_B8
S29GL-M MirrorBitTM Flash Family
19
Data
Sheet
Notes:
1. Type 0 is standard. Specify others as required: TSOPs can be packed in Types 0 and 3; BGAs can be packed in Types 0, 2, or 3.
2. This package is recommended for new designs using TSOPs.
3. TSOP package marking omits packing type designator from the ordering part number.
4. BGA package marking omits leading “S29” and packing type designator from the ordering part number.
5. 100% Matte Sn is used for Pb-free TSOP plating.
6. SnBi is used for Pb-free TSOP plating.
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales office to
confirm availability of specific valid combinations and to check on newly released combinations.
Table 2. S29GL064M Ordering Options
S29GL064M Valid Combinations
Package Description
(Notes)
Device
Number
Speed
Option
Package, Material, &
Temperature Range
Model
Number
Packing
Type
S29GL064M
90, 10, 11
TAI, TFI
R0,R3,R4,R6,R7
0,2,3
TS048 (2, 3, 5)
TSOP
R1,R2
TS056 (2, 3, 5)
TBI, TCI
R2,R7
FPT-48P-M19 (3, 6)
TAI, TDI
R9
FPT-56P-M01 (3, 6)
BAI, BFI
R0,R3,R4,R5
FBE063 (4, 6)
Fine-Pitch BGA
FAI, FFI
R1,R2,R3,R4,R5
LAA064 (4)
Fortified BGA
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