參數(shù)資料
      型號(hào): S29GL064N11TFI060
      廠商: Spansion Inc.
      英文描述: 64 Megabit, 32 Megabit 3.0-Volt only Page Mode Flash Memory Featuring 110 nm MirrorBit Process Technology
      中文描述: 64兆,32兆位3.0伏只頁面模式閃存具有110納米MirrorBit工藝技術(shù)
      文件頁數(shù): 15/79頁
      文件大?。?/td> 2191K
      代理商: S29GL064N11TFI060
      November 16, 2007 S29GL-N_01_09
      S29GL-N MirrorBit
      Flash Family
      15
      D a t a
      S h e e t
      6.
      Ordering Information–S29GL032N
      S29GL032N Standard Products
      Standard products are available in several packages and operating ranges. The order number (Valid
      Combination) is formed by a combination of the following:
      S29GL032N
      90
      T
      A
      I
      01
      0
      PACKING TYPE
      0
      = Tray
      2
      = 7-inch Tape and Reel
      3
      = 13-inch Tape and Reel
      MODEL NUMBER
      01 =
      x8/x16, V
      CC
      = V
      IO
      = 2.7 – 3.6 V, Uniform sector, WP#/ACC = V
      IL
      protects highest addressed sector
      02 =
      x8/x16, V
      CC
      = V
      IO
      = 2.7 – 3.6 V, Uniform sector, WP#/ACC = V
      IL
      protects lowest addressed sector
      03 =
      x8/x16, V
      CC
      = 2.7 – 3.6 V, Top boot sector, WP#/ACC = V
      IL
      protects top two addressed sectors
      04 =
      x8/x16, V
      CC
      = 2.7 – 3.6 V, Bottom boot sector, WP#/ACC = V
      IL
      protects bottom two addressed sectors
      V1 =
      x8/x16, V
      CC
      = 2.7 – 3.6 V, V
      IO
      = 1.65 - 3.6 V, Uniform sector, WP#/ACC = V
      IL
      protects highest addressed
      sector
      V2 =
      x8/x16, V
      CC
      = 2.7 – 3.6 V, V
      IO
      = 1.65 - 3.6 V, Uniform sector, WP#/ACC = V
      IL
      protects lowest addressed sector
      TEMPERATURE RANGE
      I
      = Industrial (–40°C to +85°C)
      PACKAGE MATERIAL SET
      A
      = Standard
      (Note 4)
      F
      = Pb-Free
      PACKAGE TYPE
      T
      =
      Thin Small Outline Package (TSOP) Standard Pinout
      B
      =
      Fine-pitch Ball-Grid Array Package
      F
      =
      Fortified Ball-Grid Array Package
      SPEED OPTION
      See Product Selector Guide and Valid Combinations (90 = 90 ns, 11 = 110 ns)
      DEVICE NUMBER/DESCRIPTION
      S29GL032N
      32 Megabit Page-Mode Flash Memory
      Manufactured using 110 nm MirrorBit
      Process Technology, 3.0 Volt-only Read, Program, and Erase
      Table 6.1
      S29GL032N Ordering Options
      (Note 4)
      S29GL032N Valid Combinations
      Package Description
      (Notes)
      Device
      Number
      Speed
      Option
      Package, Material,
      & Temperature Range
      Model
      Number
      Packing
      Type
      S29GL032N
      90
      TFI
      01, 02
      0,2,3
      (Note 1)
      TS056
      (Note 2)
      TSOP
      11
      V1, V2
      90
      FFI
      01, 02
      LAA064
      (Note 3)
      Fortified BGA
      11
      V1, V2
      90
      TFI
      03, 04
      TS048
      (Note 2)
      TSOP
      BFI
      VBK048
      (Note 3)
      Fine-Pitch BGA
      FFI
      LAA064
      (Note 3)
      Fortified BGA
      Notes
      1. Type 0 is standard. Specify others as required: TSOPs can be packed in
      Types 0 and 3; BGAs can be packed in Types 0, 2, or 3.
      2. TSOP package marking omits packing type designator from ordering
      part number.
      3. BGA package marking omits leading
      S29
      and packing type designator
      from ordering part number.
      4. Contact local sales for availability for Leaded lead-frame parts.
      Valid Combinations
      Valid Combinations list configurations planned to be supported in volume for this
      device. Consult your local sales office to confirm availability of specific valid
      combinations and to check on newly released combinations.
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