參數(shù)資料
型號(hào): S71WS512NC0BAWTJ3
廠商: SPANSION LLC
元件分類: 存儲(chǔ)器
英文描述: Stacked Multi-Chip Product (MCP)
中文描述: SPECIALTY MEMORY CIRCUIT, PBGA84
封裝: 8 X 11.60 MM, 1.40 MM HEIGHT, LEAD FREE COMPLIANT, FBGA-84
文件頁數(shù): 1/13頁
文件大小: 332K
代理商: S71WS512NC0BAWTJ3
Publication Number S71WS-N_00
Revision A
Amendment 6
Issue Date July 19, 2006
S71WS-N
S71WS-N Cover Sheet
Stacked Multi-Chip Product (MCP)
1.8 Volt-only Simultaneous Read/Write,
Burst-mode Flash Memory with CellularRAM
Data Sheet (Advance Information)
Notice to Readers: This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.
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