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7
S93662/S93663
2012 2.0 4/18/00
ABSOLUTE MAXIMUM RATINGS*
Temperature Under Bias ....................................................................................................................................
–
55
°
C to +125
°
C
Storage Temperature .........................................................................................................................................
–
65
°
C to +150
°
C
Voltage on any Pin with Respect to Ground
(1)
............................................................................................
–
2.0V to +V
CC
+2.0V
V
CC
with Respect to Ground..................................................................................................................................
–
2.0V to +7.0V
Package Power Dissipation Capability (Ta = 25
°
C) .............................................................................................................1.0W
Lead Soldering Temperature (10 seconds) ........................................................................................................................ 300
°
C
Output Short Circuit Current
(2)
...........................................................................................................................................100mA
*COMMENT
Stresses above those listed under
“
Absolute Maximum Ratings
”
may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions outside of those listed in the operational sections of this specification is not implied. Exposure to
any absolute maximum rating for extended periods may affect device performance and reliability.
RECOMMENDED OPERATING CONDITIONS
Note:
(1) The minimum DC input voltage is
–
0.5V. During transitions, inputs may undershoot to
–
2.0V for periods of less than 20ns. Maximum DC
voltage on output pins is V
CC
+0.5V, which may overshoot to V
CC
+2.0V for periods of less than 20ns.
(2) Output shorted for no more than one second. No more than one output shorted at a time.
(3) This parameter is tested initially and after a design or process change that affects the parameter.
(4) Latch-up protection is provided for stresses up to 100mA on address and data pins from
–
1V to V
CC
+1V.
D.C. OPERATING CHARACTERISTICS
(over recommended operating conditions unless otherwise specified)
Limits
Typ.
Symbol
I
CC
Parameter
Min.
Max.
3
Units
mA
Test Conditions
DI = 0.0V, f
SK
= 1MHz
V
CC
= 5.0V, CS = 5.0V,
Output Open
Power Supply Current
(Operating)
I
SB
Power Supply Current
(Standby)
50
μA
CS = 0V
Reset Outputs Open
I
LI
I
LO
Input Leakage Current
2
μA
V
IN
= 0V to V
CC
V
OUT
= 0V to V
CC
,
CS = 0V
Output Leakage Current
(Including ORG pin)
10
μA
V
IL1
V
IH1
V
IL2
V
IH2
V
OL1
V
OH1
Input Low Voltage
Input High Voltage
-0.1
2
0.8
V
V
4.5V-V
CC
<5.5V
V
CC
+1
V
CC
×
0.2
V
CC
+1
0.4
Input Low Voltage
Input High Voltage
0
V
V
1.8V-V
CC
<2.7V
V
CC
×
0.7
Output Low Voltage
Output High Voltage
V
V
4.5V-V
CC
<5.5V
I
OL
= 2.1mA
I
OH
= -400μA
1.8V-V
CC
<2.7V
I
OL
= 1mA
I
OH
= -100μA
2.4
V
OL2
V
OH2
Output Low Voltage
Output High Voltage
0.2
V
V
V
CC
-0.2
2012 PGM T3 1.1
RELIABILITY CHARACTERISTICS
Symbol
N
END(3)
Parameter
Min.
Max.
Units
Reference Test Method
Endurance
100,000
Cycles/Byte
MIL-STD-883, Test Method 1033
T
DR(3)
Data Retention
100
Years
MIL-STD-883, Test Method 1008
V
ZAP(3)
ESD Susceptibility
2000
Volts
MIL-STD-883, Test Method 3015
I
LTH(3)(4)
Latch-Up
100
mA
JEDEC Standard 17
2012 PGM T2 1.1
Temperature
Commercial
Industrial
Min
0
°
C
-40
°
C
Max
+70
°
C
+85
°
C
2012 PGM T7 1.0