參數(shù)資料
型號(hào)： SA56004AD
廠商： NXP Semiconductors N.V.
元件分類： 溫度/濕度傳感器
英文描述： +--1 deg Cel accurate, SMBus-compatible, 8-pin, remote-local digital temperature sensor with overtemperature alarms
封裝： SA56004AD<SOT96-1 (SO8)|<<http://www.nxp.com/packages/SOT96-1.html<1<week 11, 2005,;SA56004AD<SOT96-1 (SO8)|<<http://www.nxp.com/packages/SOT96-1.html<1<week 11, 20
文件頁(yè)數(shù)： 31/36頁(yè)
文件大?。?/td> 197K
代理商： SA56004AD
SA56004X_5
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 22 May 2008
31 of 36
NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
14.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
Figure 24
) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 20
and
21
Table 20.
Package thickness (mm)
SnPb eutectic process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
235
220
≥
350
220
220
< 2.5
≥
2.5
相關(guān)PDF資料
PDF描述
SA56004FDP +--1 deg Cel accurate, SMBus-compatible, 8-pin, remote-local digital temperature sensor with overtemperature alarms
SA56004BDP +--1 deg Cel accurate, SMBus-compatible, 8-pin, remote-local digital temperature sensor with overtemperature alarms
SA56004CDP +--1 deg Cel accurate, SMBus-compatible, 8-pin, remote-local digital temperature sensor with overtemperature alarms
SA56004FD +--1 deg Cel accurate, SMBus-compatible, 8-pin, remote-local digital temperature sensor with overtemperature alarms
SA56004GD +--1 deg Cel accurate, SMBus-compatible, 8-pin, remote-local digital temperature sensor with overtemperature alarms
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SA56004AD,112 功能描述:板上安裝溫度傳感器 I2C LOC +/- 2OC AND RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準(zhǔn)確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關(guān)閉: 安裝風(fēng)格: 封裝 / 箱體: 設(shè)備功能:Temperature and Humidity Sensor
SA56004AD,118 功能描述:板上安裝溫度傳感器 I2C LOC +/- 2OC AND RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準(zhǔn)確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關(guān)閉: 安裝風(fēng)格: 封裝 / 箱體: 設(shè)備功能:Temperature and Humidity Sensor
SA56004ADP 制造商:NXPSEM 功能描述:
SA56004ADP,118 功能描述:板上安裝溫度傳感器 TEMP SENSOR RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準(zhǔn)確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關(guān)閉: 安裝風(fēng)格: 封裝 / 箱體: 設(shè)備功能:Temperature and Humidity Sensor
SA56004AD-T 功能描述:板上安裝溫度傳感器 I2C LOC +/- 2OC AND REM +/- 1OC TS RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準(zhǔn)確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關(guān)閉: 安裝風(fēng)格: 封裝 / 箱體: 設(shè)備功能:Temperature and Humidity Sensor
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