參數(shù)資料
型號(hào): SA56004BDP
廠商: NXP Semiconductors N.V.
元件分類: 工業(yè)控制
英文描述: +--1 deg Cel accurate, SMBus-compatible, 8-pin, remote-local digital temperature sensor with overtemperature alarms
封裝: SA56004AD<SOT96-1 (SO8)|<<http://www.nxp.com/packages/SOT96-1.html<1<week 11, 2005,;SA56004AD<SOT96-1 (SO8)|<<http://www.nxp.com/packages/SOT96-1.html<1<week 11, 20
文件頁(yè)數(shù): 32/36頁(yè)
文件大?。?/td> 197K
代理商: SA56004BDP
SA56004X_5
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 22 May 2008
32 of 36
NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Figure 24
.
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”
15. Mounting
15.1 Printed-circuit board layout considerations
Care must be taken in Printed-Circuit Board (PCB) layout to minimize noise induced at the
remote temperature sensor inputs, especially in extremely noisy environments, such as a
computer motherboard. Noise induced in the traces running between the device sensor
inputs and the remote diode can cause temperature conversion errors. Typical sensor
signal levels to the SA56004X is a few microvolts. The following guidelines are
recommended:
1. Place the SA56004X as close as possible to the remote sensor. It can be from
4 inches to 8 inches, as long as the worst noise sources such as clock generator, data
and address buses, CRTs are avoided.
Table 21.
Package thickness (mm)
Lead-free process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
260
260
250
350 to 2000
260
250
245
> 2000
260
245
245
< 1.6
1.6 to 2.5
> 2.5
MSL: Moisture Sensitivity Level
Fig 24. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
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參數(shù)描述
SA56004BDP,118 功能描述:板上安裝溫度傳感器 I2C LOC +/- 2OC AND RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準(zhǔn)確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關(guān)閉: 安裝風(fēng)格: 封裝 / 箱體: 設(shè)備功能:Temperature and Humidity Sensor
SA56004BDP-T 功能描述:板上安裝溫度傳感器 I2C LOC +/- 2OC AND REM +/- 1OC TS RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準(zhǔn)確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關(guān)閉: 安裝風(fēng)格: 封裝 / 箱體: 設(shè)備功能:Temperature and Humidity Sensor
SA56004BD-T 功能描述:板上安裝溫度傳感器 I2C LOC +/- 2OC AND REM +/- 1OC TS RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準(zhǔn)確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關(guān)閉: 安裝風(fēng)格: 封裝 / 箱體: 設(shè)備功能:Temperature and Humidity Sensor
SA56004CD 功能描述:板上安裝溫度傳感器 I2C LOC +/- 2OC AND REM +/- 1OC TS RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準(zhǔn)確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關(guān)閉: 安裝風(fēng)格: 封裝 / 箱體: 設(shè)備功能:Temperature and Humidity Sensor
SA56004CD,112 功能描述:板上安裝溫度傳感器 I2C LOC +/- 2OC AND RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準(zhǔn)確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關(guān)閉: 安裝風(fēng)格: 封裝 / 箱體: 設(shè)備功能:Temperature and Humidity Sensor