參數(shù)資料
型號(hào)： SA56004HD
廠商： NXP Semiconductors N.V.
元件分類： 溫度/濕度傳感器
英文描述： +--1 deg Cel accurate, SMBus-compatible, 8-pin, remote-local digital temperature sensor with overtemperature alarms
封裝： SA56004AD<SOT96-1 (SO8)|<<http://www.nxp.com/packages/SOT96-1.html<1<week 11, 2005,;SA56004AD<SOT96-1 (SO8)|<<http://www.nxp.com/packages/SOT96-1.html<1<week 11, 20
文件頁(yè)數(shù)： 30/36頁(yè)
文件大?。?/td> 197K
代理商： SA56004HD
SA56004X_5
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 22 May 2008
30 of 36
NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
13. Packing information
The SA56004X is packed in reels, as shown in
Figure 23
.
14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Fig 23. Tape and reel packing method
box
barcode label
guard band
tape
reel assembly
tape detail
cover tape
carrier tape
002aad226
相關(guān)PDF資料
PDF描述
SA56004HDP +--1 deg Cel accurate, SMBus-compatible, 8-pin, remote-local digital temperature sensor with overtemperature alarms
SA56004AD +--1 deg Cel accurate, SMBus-compatible, 8-pin, remote-local digital temperature sensor with overtemperature alarms
SA56004FDP +--1 deg Cel accurate, SMBus-compatible, 8-pin, remote-local digital temperature sensor with overtemperature alarms
SA56004BDP +--1 deg Cel accurate, SMBus-compatible, 8-pin, remote-local digital temperature sensor with overtemperature alarms
SA56004CDP +--1 deg Cel accurate, SMBus-compatible, 8-pin, remote-local digital temperature sensor with overtemperature alarms
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SA56004HD,112 功能描述:板上安裝溫度傳感器 I2C LOC +/- 2OC AND RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準(zhǔn)確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關(guān)閉: 安裝風(fēng)格: 封裝 / 箱體: 設(shè)備功能:Temperature and Humidity Sensor
SA56004HD,118 功能描述:板上安裝溫度傳感器 I2C LOC +/- 2OC AND RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準(zhǔn)確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關(guān)閉: 安裝風(fēng)格: 封裝 / 箱體: 設(shè)備功能:Temperature and Humidity Sensor
SA56004HDP 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:1 Degrees Celcious accurate, SMBus-compatible, 8-pin, remote/local digital temperature sensor with over temperature alarms
SA56004HDP,118 功能描述:板上安裝溫度傳感器 I2C LOC +/- 2OC AND RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準(zhǔn)確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關(guān)閉: 安裝風(fēng)格: 封裝 / 箱體: 設(shè)備功能:Temperature and Humidity Sensor
SA56004HDP-T 功能描述:板上安裝溫度傳感器 I2C LOC +/- 2OC AND REM +/- 1OC TS RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準(zhǔn)確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關(guān)閉: 安裝風(fēng)格: 封裝 / 箱體: 設(shè)備功能:Temperature and Humidity Sensor
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