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參數(shù)資料
| 型號： | SA5778 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Serial triple gauge driver STGD |
| 中文描述： | 串行三規(guī)司機STGD |
| 文件頁數(shù)： | 10/16頁 |
| 文件大?。?/td> | 122K |
| 代理商： | SA5778 |
Philips Semiconductors
Product specification
SA5778
Serial triple gauge driver (STGD)
1998 Apr 03
10
Sample Calculations for Power Dissipation and
Thermal Management
Worst Case Example
The worst case example will occur when the STGD is operating at
V
BATTMAX
(16V, in the highest specified ambient temperature
(105
°
C), and with the lowest specified coil resistance (171 ohms at
25
°
C). Typical coil self heating of 15
°
C is assumed.
Calculation of Coil resistance operating at 105
°
C ambient.
RCA
= R
CN
(1+(0.4%W/
°
C)*((T
SH
+T
amb
)–25
°
C))
= 171 x(1+(0.4%((15+105)–25)))
= 236 Ohms at T
amb
=105
°
C, with 15
°
C of self heating.
Calculation of STGD power dissipation at 16 volt operation.
P
D
= V
BATT
(V
BATT
/R
C
) + V
BATT
(0.012)
+V
OL2
(V
BATT
– V
OL2
– V
BE(PNP)
) / R
L
= 16(16/236)+16(0.012)+1.5(16–1.5–0.5)/320
= 1.085+0.192+0.066 Watts
= 1.34 Watts
Required board area and Junction Temperature calculation
The maximum junction temperature desired is 150
°
C. The
permissible temperature rise and required
Θ
JA
may be calculated
as:
T = T
j
–T
amb
Θ
JA
=
T/P
D
Where;
T = Temperature rise in
°
C
P
D
= Power dissipation
T
j
= Junction Temperature
T
amb
= Ambient Temperature
T = T
J
–T
amb
= 150 – 105 = 45
°
C
Θ
JA
=
T/P
D
=55
°
C/1.34 watts = 33
°
C/W.
From Figure 8, the copper area required, using a single sided board,
to keep the junction temperature within limits is approximately
2200 mm
2
. Figure 9 shows 1200 mm
2
is required on each side of a
double-sided board.
The above example illustrates the worst case situation of the STGD
operating in at a maximum battery voltage, with the lowest nominal
coil resistance (171
at room temperature), and at the highest
ambient temperature. This will produce the highest junction
temperature. At lower ambient temperatures the power dissipation
may be higher because the coil resistance is decreased, however
the junction temperature will be lower.
Serial Interface
Figure 10 demonstrates the serial interface timing referenced in the
AC specifications. Figure 11 shows the order of information transfer
through the serial interface. On a low to high transition of the CS pin,
status information replaces the four most significant bits of data in
the shift register and are the first bits shifted out. Output data is
changed on the falling edge of S
CLK
, while input data is captured on
the rising edge of S
CLK
. Major gauge data is loaded first, starting
with the most significant bit, followed by minor gauge 1 data then
minor gauge 2 data.
DATA
OUT
S4
D1*
D0*
t
DF
t
DR
t
SU
DATA
IN
D29
D1
D0*
t
HD
CS
30 CLOCK CYCLES
t
CSH
S
CLK
1
29
30
t
CF
t
CR
t
CYC
t
SCLKL
t
CSL
t
SCLKH
SR01499
Figure 10.
Serial Interface Timing
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