參數(shù)資料
型號: SA58670
廠商: NXP Semiconductors N.V.
英文描述: 2.1 W/channel stereo Class D audio amplifier
中文描述: 2.1瓦/聲道立體聲D類音頻放大器
文件頁數(shù): 11/18頁
文件大?。?/td> 142K
代理商: SA58670
SA58670_1
NXP B.V. 2007. All rights reserved.
Objective data sheet
Rev. 01 — 22 June 2007
11 of 18
NXP Semiconductors
SA58670
2.1 W/channel stereo Class D audio amplifier
11.6 Additional thermal information
The SA58670 HVQFN20 package incorporates an exposed die attach paddle (DAP) that
is designed to solder mount directly to the PCB heat spreader. By the use of thermal vias,
the DAP may be soldered directly to a ground plane or special heat sinking layer designed
into the PCB. The thickness and area of the heat spreader may be maximized to optimize
heat transfer and achieve lowest package thermal resistance.
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參數(shù)描述
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SA58670A 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:2.1 W/channel stereo class-D audio amplifier
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