參數(shù)資料
型號(hào)： SA58670ABS
廠商： NXP Semiconductors N.V.
元件分類(lèi)： 音頻放大器
英文描述： 2.1 W-channel stereo class-D audio amplifier
封裝： SA58670ABS<SOT917-1 (HVQFN20)|<<http://www.nxp.com/packages/SOT917-1.html<1<Always Pb-free,;
文件頁(yè)數(shù)： 14/24頁(yè)
文件大小： 169K
代理商： SA58670ABS
SA58670A_2
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 02 — 23 October 2008
21 of 24
NXP Semiconductors
SA58670A
2.1 W/channel stereo class-D audio amplier
14.4 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 19) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 7 and 8
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 19.
Table 7.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 8.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
相關(guān)PDF資料
PDF描述
SA58670BS 2.1 W-channel stereo class-D audio amplifier
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SA58672UK 3.0 W mono class-D audio amplifier
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SA58670ABS,115 功能描述:音頻放大器 2.1W/CH CLASS D RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
SA58670ABS115 制造商:NXP Semiconductors 功能描述:IC AUDIO AMP D 2.1W QFN-20
SA58670ABS-G 功能描述:音頻放大器 2.1W/CH CLASS D AUDIO AMP RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
SA58670BS 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:2.1 W/channel stereo class-D audio amplifier
SA58670BS,115 功能描述:音頻放大器 2.1W/CH CLASS D RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
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