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| 型號： | SA58672TK |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 音頻放大器 |
| 英文描述： | 3.0 W mono class-D audio amplifier |
| 封裝： | SA58672TK<SOT650-2 (HVSON10)|<<http://www.nxp.com/packages/SOT650-2.html<1<Always Pb-free,;SA58672UK<Uncased die|<<<1<Always Pb-free,; |
| 文件頁數(shù)： | 16/27頁 |
| 文件大?。?/td> | 183K |
| 代理商： | SA58672TK |
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SA58672_4
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 8 June 2009
23 of 27
NXP Semiconductors
SA58672
3.0 W mono class-D audio amplier
Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic) while being low enough that the packages and/or boards are not
damaged. The peak temperature of the package depends on package thickness and
volume and is classied in accordance with Table 8.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 19.
For further information on temperature proles, refer to application note
AN10365
“Surface mount reow soldering description”.
15.3.1 Stand off
The stand off between the substrate and the chip is determined by:
The amount of printed solder on the substrate
The size of the solder land on the substrate
Table 8.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
MSL: Moisture Sensitivity Level
Fig 19. Temperature proles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| SA58672UK | 3.0 W mono class-D audio amplifier |
| SAA-50T-3 | 2 mm2, BRASS, TIN FINISH, FORK TERMINAL |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SA58672TK,138 | 功能描述:音頻放大器 Audio Amp SPKR 1-CH Mono 3W ClassD 10Pin RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| SA58672TK138 | 制造商:NXP Semiconductors 功能描述:IC AUDIO AMP D 3W SON-10 |
| SA58672UK | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:3.0 W mono class-D audio amplifier |
| SA58672UK,027 | 功能描述:音頻放大器 3.W MONO CLASS D RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| SA58672UK-G | 功能描述:音頻放大器 3.W MONO CLASS D AUDIO AMP RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
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