參數(shù)資料
型號: SAA-C505CA-4RC
廠商: INFINEON TECHNOLOGIES AG
英文描述: 8-bit Single-Chip Microcontroller (Bare Die Delivery)
中文描述: 8位單片機(裸片交付)
文件頁數(shù): 20/22頁
文件大?。?/td> 322K
代理商: SAA-C505CA-4RC
C505CA-4RC
Step BB
Data Sheet
20
V1.3, 2000-12
The wafers are glued to a plastic tape which is fixed within a plastic ring (see figure
below).
Wafers can be shipped in one piece or sawn into individual dies.
Table 5
Item
Chips per wafer
Metallization layers
Metallization material
Metallization thickness
Metallization barrier material
Metallization isolation
Metallization material on pads
Passivation
Backside metallization
Inkdot diameter
Wafer Characteristics
Characteristic
820
2
AICu
Met1: 450 nm, Met2: 800 nm
Ti/Tin
FLOW-FILL
AICu (AI 99.5% - Cu 0.5%)
Si-Oxide (310 nm) + Si-Nitride (510 nm)
None (silicon)
1.0-1.3 mm (typical)
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