參數(shù)資料
型號(hào)： SAA5296PS
廠商： NXP Semiconductors N.V.
英文描述： Economy teletext and TV microcontrollers(經(jīng)濟(jì)的圖文電視和TV控制器)
中文描述： 經(jīng)濟(jì)圖文電視和電視微控制器（經(jīng)濟(jì)的圖文電視和電視控制器）
文件頁數(shù)： 69/72頁
文件大?。?/td> 652K
代理商： SAA5296PS
1998 Dec 14
69
Philips Semiconductors
Preliminary specification
Economy teletext and TV microcontrollers
SAA5x9x family
18.4
Suitability of IC packages for wave, reflow and dipping soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
6.
MOUNTING
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
suitable
suitable
suitable
suitable
suitable
DIPPING
Through-hole mount DBS, DIP, HDIP, SDIP, SIL
Surface mount
BGA, SQFP
HLQFP, HSQFP, HSOP, HTSSOP, SMS
PLCC
(4)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
(2)
not suitable
not suitable
(3)
suitable
not recommended
(4)(5)
not recommended
(6)
suitable
相關(guān)PDF資料
PDF描述
SAA5355 Single-chip colour CRT controller FTFROM
SAA5360 Multi page intelligent teletext decoder
SAA5360HL Multi page intelligent teletext decoder
SAA5361 Multi page intelligent teletext decoder
SAA5361HL Multi page intelligent teletext decoder
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SAA5296XP/NV 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Teletext Circuit
SAA5296ZP/NNN 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Teletext Circuit
SAA5297 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Economy teletext and TV microcontrollers
SAA5297A 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Economy teletext and TV microcontrollers
SAA5297AH 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Economy teletext and TV microcontrollers
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*