參數(shù)資料
型號： SAF-XC2287M-72F80LAA
廠商： INFINEON TECHNOLOGIES AG
元件分類： 微控制器/微處理器
英文描述： RISC MICROCONTROLLER, PQFP144
封裝： 0.50 mm pitch, GREEN, PLASTIC, LQFP-144
文件頁數(shù)： 45/142頁
文件大?。?/td> 1112K
代理商： SAF-XC2287M-72F80LAA
XC2287M, XC2286M, XC2285M
XC2000 Family Derivatives / Base Line
Package and Reliability
Data Sheet
139
V2.0, 2009-03
5
Package and Reliability
In addition to the electrical parameters, the following specifications ensure proper
integration of the XC228xM into the target system.
5.1
Packaging
These parameters specify the packaging rather than the silicon.
Note: To improve the EMC behavior, it is recommended to connect the exposed pad to
the board ground, independent of the thermal requirements.
Board layout examples are given in an application note.
Package Compatibility Considerations
The XC228xM is a member of the XC2000 Family of microcontrollers. It is also
compatible to a certain extent with members of similar series and subfamilies.
Each package is optimized for the chip it houses. Therefore, there may be slight
differences between packages of the same pin-count but for different device types. In
particular, the size of the Exposed Pad (if present) may vary.
If different device types are considered or planned for an application, it must be ensured
that the board layout fits all packages under consideration.
Table 41
Package Parameters (PG-LQFP-144-13)
Parameter
Symbol
Limit Values
Unit Notes
Min.
Max.
Exposed Pad Dimension
Ex
× Ey –
6.5
× 6.5
mm –
Power Dissipation
P
DISS
–1.0
W
–
Thermal resistance
Junction-Ambient
RΘJA
–
43
K/W No thermal via1)
1) Device mounted on a 2-layer JEDEC board (according to JESD 51-3) or a 4-layer board without thermal vias;
exposed pad not soldered.
34
K/W 4-layer, no pad2)
2) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad not
soldered.
21
K/W 4-layer, pad3)
3) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad soldered
to the board.
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