參數(shù)資料
型號(hào)： SAH-XC2387C-104F100L
廠商： INFINEON TECHNOLOGIES AG
元件分類： 微控制器/微處理器
英文描述： 32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PQFP144
封裝： 0.50 MM PITCH, GREEN, PLASTIC, LQFP-144
文件頁數(shù)： 52/147頁
文件大?。?/td> 1798K
代理商： SAH-XC2387C-104F100L
XC2387C, XC2388C
XC2000 Family Derivatives / High Line
Package and Reliability
Data Sheet
145
V1.2, 2010-09
5.2
Thermal Considerations
When operating the XC238xC in a system, the total heat generated in the chip must be
dissipated to the ambient environment to prevent overheating and the resulting thermal
damage.
The maximum heat that can be dissipated depends on the package and its integration
into the target board. The “Thermal resistance
RΘJA” quantifies these parameters. The
power dissipation must be limited so that the average junction temperature does not
exceed 150 °C.
The difference between junction temperature and ambient temperature is determined by
ΔT = (P
INT + PIOSTAT + PIODYN) × R
ΘJA
The internal power consumption is defined as
P
INT = VDDP × IDDP (switching current and leakage current).
The static external power consumption caused by the output drivers is defined as
P
IOSTAT = Σ((VDDP-VOH) × IOH) + Σ(VOL × IOL)
The dynamic external power consumption caused by the output drivers (
P
IODYN) depends
on the capacitive load connected to the respective pins and their switching frequencies.
If the total power dissipation for a given system configuration exceeds the defined limit,
countermeasures must be taken to ensure proper system operation:
Reduce
V
DDP, if possible in the system
Reduce the system frequency
Reduce the number of output pins
Reduce the load on active output drivers
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