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參數(shù)資料
| 型號： | SC16C850LIB |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 收發(fā)器 |
| 英文描述： | 1.8 V single UART, 5 Mbit-s (max.) with 128-byte FIFOs, infrared (IrDA) and 16 mode or 68 mode parallel bus interface |
| 封裝： | SC16C850LIB<SOT313|<<<1<Always Pb-free,;SC16C850LIB<SOT313|<<<1<Always Pb-free,;SC16C850LIB<SOT313|<<<1<Always Pb-free,;SC16C850LIBS<SOT617-1 (HVQFN3 |
| 文件頁數(shù)： | 50/55頁 |
| 文件大小： | 1029K |
| 代理商： | SC16C850LIB |
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SC16C850L
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 1 February 2011
50 of 55
NXP Semiconductors
SC16C850L
1.8 V single UART with 128-byte FIFOs and IrDA encoder/decoder
12.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
Figure 25
) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 39
and
40
Table 39.
Package thickness (mm)
Table 40.
Package thickness (mm)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Figure 25
.
SnPb eutectic process (from J-STD-020C)
Package reflow temperature (
C)
Volume (mm
3
)
< 350
235
220
350
220
220
< 2.5
2.5
Lead-free process (from J-STD-020C)
Package reflow temperature (
C)
Volume (mm
3
)
< 350
260
260
250
350 to 2000
260
250
245
> 2000
260
245
245
< 1.6
1.6 to 2.5
> 2.5
相關PDF資料 |
PDF描述 |
|---|---|
| SC16C850LIBS | 1.8 V single UART, 5 Mbit-s (max.) with 128-byte FIFOs, infrared (IrDA) and 16 mode or 68 mode parallel bus interface |
| SC16C850LIET | 1.8 V single UART, 5 Mbit-s (max.) with 128-byte FIFOs, infrared (IrDA) and 16 mode or 68 mode parallel bus interface |
| SC16C850SVIBS | 1.8 V single UART, 20 Mbit-s (max.) with 128-byte FIFOs, infrared (IrDA), and XScale VLIO bus interface |
| SC16C850VIBS | 1.8 V single UART, 5 Mbit-s (max.) with 128-byte FIFOs, infrared (IrDA), and XScale VLIO bus interface |
| SC16C852LIB | 1.8 V dual UART, 5 Mbit-s (max.) with 128-byte FIFOs, infrared (IrDA) and 16 mode or 68 mode bus interface |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| SC16C850LIB,128 | 制造商:NXP Semiconductors 功能描述: |
| SC16C850LIB,151 | 制造商:NXP Semiconductors 功能描述: |
| SC16C850LIB,157 | 制造商:NXP Semiconductors 功能描述: |
| SC16C850LIBS | 功能描述:UART 接口集成電路 1.8V 1 CH UART 128B FIFO 5MBPS RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16C850LIBS,115 | 功能描述:UART 接口集成電路 1.8V 1 CH UART RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
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