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參數(shù)資料
| 型號(hào)： | SC16IS762IPW |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 連接器件 |
| 英文描述： | Dual UART with I2C-bus-SPI interface, 64 bytes of transmit and receive FIFOs, IrDA SIR built-in support |
| 封裝： | SC16IS752IBS<SOT617-1 (HVQFN32)|<<http://www.nxp.com/packages/SOT617-1.html<1<Always Pb-free,;SC16IS752IBS<SOT617-1 (HVQFN32)|<<http://www.nxp.com/packages/SOT617-1.html& |
| 文件頁(yè)數(shù)： | 55/60頁(yè) |
| 文件大?。?/td> | 356K |
| 代理商： | SC16IS762IPW |
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SC16IS752_SC16IS762
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 8 — 1 September 2011
55 of 60
NXP Semiconductors
SC16IS752; SC16IS762
Dual UART with I
2
C-bus/SPI interface, 64-byte FIFOs, IrDA SIR
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
17.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
Figure 39
) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 40
and
41
Table 40.
Package thickness (mm)
Table 41.
Package thickness (mm)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Figure 39
.
SnPb eutectic process (from J-STD-020C)
Package reflow temperature (
C)
Volume (mm
3
)
< 350
235
220
350
220
220
< 2.5
2.5
Lead-free process (from J-STD-020C)
Package reflow temperature (
C)
Volume (mm
3
)
< 350
260
260
250
350 to 2000
260
250
245
> 2000
260
245
245
< 1.6
1.6 to 2.5
> 2.5
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SC16IS762IPW,112 | 功能描述:UART 接口集成電路 DUAL UART 64BYTE RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16IS762IPW,128 | 功能描述:UART 接口集成電路 I2C/SPI-UARTBRIDGE RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16IS762IPW112 | 制造商:NXP Semiconductors 功能描述:IC DUAL UART FIFO 5MBPS 3.6V TSSOP28 |
| SC16IS762IPW-F | 功能描述:UART 接口集成電路 I2C/SPI-UARTBRIDGE W/IRDA AND GPIO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16IS762IPW-S | 功能描述:IC UART DUAL I2C/SPI 28-TSSOP RoHS:是 類別:集成電路 (IC) >> 接口 - UART（通用異步接收器/發(fā)送器） 系列:- 標(biāo)準(zhǔn)包裝:250 系列:- 特點(diǎn):* 通道數(shù):2，DUART FIFO's:16 字節(jié) 規(guī)程:RS232，RS485 電源電壓:2.25 V ~ 5.5 V 帶并行端口:- 帶自動(dòng)流量控制功能:是 帶IrDA 編碼器/解碼器:是 帶故障啟動(dòng)位檢測(cè)功能:是 帶調(diào)制解調(diào)器控制功能:是 帶CMOS:是 安裝類型:表面貼裝 封裝/外殼:48-TQFP 供應(yīng)商設(shè)備封裝:48-TQFP（7x7） 包裝:托盤 其它名稱:XR16L2551IM-F-ND |
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