Philips Semiconductors
Product specification
SC68C562
CMOS Dual universal serial communications controller
(CDUSCC)
1998 Sep 04
8
DC ELECTRICAL CHARACTERISTICS
4, 5
T
A
= 0 to +70
°
C, –40 to +85 C, V
CC
= 5.0V
10%
SYMBOL
PARAMETER
TEST CONDITIONS
LIMITS
Typ
UNIT
Min
Max
V
IL
V
IH
Input low voltage:
All except X1/CLK
X1/CLK
Input high voltage:
All except X1/CLK
X1/CLK
0 to 70 C
–40 to 85 C
2.0
2.3
0.8xV
CC
0.8
0.8
V
CC
V
V
V
V
V
V
OL
V
OH
Output low voltage:
14
All except IRQN
IRQN
7
Output high voltage:
14
(Except open drain outputs)
I
OL
= 5.3mA (Comm), 4.8mA
(Indus)
I
OL
= 8.8mA (Comm), 7.8mA
(Indus)
I
OH
= -400
μ
A
V
IN
= 0, X2 = GND
V
IN
= V
CC
, X2 = GND
X1 open V
IN
= 0
V
IN
= V
CC
V
CC
–0.5
0.5
0.5
V
V
V
I
ILX1
I
IHX1
I
SCX2
X1/CLK input low current
10
X1/CLK input high current
10
X2 short circuit current (X2 mode)
–150
0.0
150
–15
+15
μ
A
μ
A
mA
mA
I
IL
Input low current
RESETN, DTCN, TxDAKA/BN,
RTxDAKA/BN
Input leakage current
V
IN
= 0
-15
–0.5
μ
A
I
L
V
IN
= 0 to V
CC,
0 to 70 C
–40 to 85 C
V
IN
= V
0 to 70 C
–40 to 85 C
V
IN
= 0
,
0 to 70 C
–40 to 85 C
V
IN
= 0
V
IN
= V
CC
-1
–10
+1
+10
+1
+10
μ
A
I
OZH
Output off current high, 3-State data bus
μ
A
μ
A
μ
A
μ
A
I
OZL
Output off current low, 3-State data bus
-1
–10
I
ODL
I
ODH6
Open drain output low current in off
state:
DONEN
,
DTACKN (3-state)
IRQN
Open drain output high current in off
state:
DONEN, IRQN, DTACKN (3-state)
Power supply current
16
(See Figure 17 for graphs)
Input capacitance
9
Output capacitance
9
Input/output capacitance
9
-1
5
-1
–1
-0.5
+1
80
95
10
15
20
μ
A
μ
A
μ
A
mA
I
CC
0 to 70 C
–40 to 85 C
V
CC
= GND = 0
V
CC
= GND = 0
V
CC
= GND = 0
25
C
IN
C
OUT
C
I/O
NOTES:
1. Stresses above those listed under Abs. Max Ratings may cause permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the operation section of this specification is not implied.
2. Clock may be stopped (DC) for testing purposes or when the CDUSCC is in non-operational modes. Operation down to 0 rate clocks is
implied by a full static CMOS design, but is not verified in testing or characterization.
3. This product includes circuitry specifically designed for the protection of its internal devices from damaging effects of excessive static
charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying any voltages larger than the rated maxima.
4. Parameters are valid over specified temperature and voltage range.
5. All voltage measurements are referenced to ground (GND). For testing, all inputs except X1/CLK swing between 0.2V and 3.0V with a transi-
tion time of 20ns maximum. For X1/CLK, this swing is between 0.2V and 4.4V. All time measurements are referenced at input voltages of
0.2V and 3.0V and output voltages of 0.8V and 2.0V, as appropriate.
6. See Figure 18 for test conditions for outputs.
7. Tests for open drain outputs are intended to guarantee switching of the output transistor. To include noise margin this response is measured
from the switching signal midpoint to 0.2 V above the required output level.
8. Execution of the valid command (after it is latched) requires a minimum of three rising edges of X1 (see Figure 19).
9. These values were no explicitly tested; they are guaranteed by design and characterization data.
10.X1/CLK and X2 are not tested with a crystal installed.
11. X1/CLK frequency must be at least as fast as the faster of the receiver or transmitter data rate.
12.The X1 clock drives DTACKN, Baud Rate Generator, command register and the update of the FIFO fill level encoders. The Command
Register requires three X1 clocks between two commands; FIFO fill level encoding requires 2.5 to 3.5 X1 cycles.
13.The 68562 bus interface may be operated in two modes; a 68000 compatible mode with automatic DTACK generation and a short chip
select mode. DTACKN should not be used externally in the short chip select mode. The DTACKN signal is generated by the assertion of
the chip select, and data is latched by assertion of DTACKN or by de-assertion of the chip select, whichever comes first. In single address
DMA, the DTACK signal will be de-asserted by the assertion of the DTCN or from the de-assertion of the TxDAKN, whichever occurs first.
14.Also includes X2/IDCN pin in IDC mode.
15.In case of 3-state output, output levels V
+ 0.2 are considered float or high impedance.
16.V
O
= 0 to V
CC
, Rx/Tx at 10MHz and X1 at 10MHz
pF
pF
pF