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參數(shù)資料
| 型號： | SCG002B-G |
| 英文描述： | InGaP HBT Gain Block |
| 中文描述： | InGaP HBT增益模塊 |
| 文件頁數(shù)： | 4/4頁 |
| 文件大?。?/td> | 189K |
| 代理商： | SCG002B-G |
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
Page 4 of 4 April 2007
SCG002
InGaP HBT Gain Block
SCG002B-G Mechanical Information
This package is lead-free/Green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free
(maximum 260
°
C reflow temperature) and leaded (maximum 245
°
C reflow temperature) soldering processes.
Outline Drawing
Land Pattern
Product Marking
The component will be marked with an
“S002G” designator with an alphanumeric lot
code on the top surface of the package. The
obsolete tin-lead package is marked with an
“S002”
designator
alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
followed
by
an
MSL / ESD Rating
ESD Rating: Class 1A
Value:
Test:
Standard:
MSL Rating: Level 3 at +260
°
C convection reflow
Standard:
JEDEC Standard J-STD-020
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of
this device. Vias should use a .35mm (#80 / .0135”) diameter
drill and have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board
to a heatsink. Ensure that the ground / thermal via region
contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
Rating
-40 to +85
°
C
131
°
C/W
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| SCG002B-PCB | InGaP HBT Gain Block |
| SCG015 | Watt, High Linearity InGaP HBT Amplifier |
| SCG015_06 | Watt, High Linearity InGaP HBT Amplifier |
| SCG015B-G | Watt, High Linearity InGaP HBT Amplifier |
| SCG015B-PCB1960 | Watt, High Linearity InGaP HBT Amplifier |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SCG002B-PCB | 功能描述:射頻開發(fā)工具 700-2400MHz Eval Brd 20dB Gain RoHS:否 制造商:Taiyo Yuden 產(chǎn)品:Wireless Modules 類型:Wireless Audio 工具用于評估:WYSAAVDX7 頻率: 工作電源電壓:3.4 V to 5.5 V |
| SCG015 | 制造商:WJCI 制造商全稱:WJCI 功能描述: Watt, High Linearity InGaP HBT Amplifier |
| SCG015_06 | 制造商:WJCI 制造商全稱:WJCI 功能描述: Watt, High Linearity InGaP HBT Amplifier |
| SCG015B | 制造商:WJCI 制造商全稱:WJCI 功能描述:1/4 Watt, High Linearity InGaP HBT Amplifier |
| SCG015B-G | 功能描述:射頻放大器 1800-2500MHz 15dB Gain RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
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