參數(shù)資料
型號： SE370C722yyz
廠商： Texas Instruments, Inc.
英文描述： TMS370 MICROCONTROLLER FAMILY DATA BOOK
中文描述： TMS370微控制器系列數(shù)據(jù)手冊
文件頁數(shù)： 69/78頁
文件大?。?/td> 919K
代理商： SE370C722YYZ
MECHANICAL DATA
4–3
POST OFFICE BOX 1443
HOUSTON, TEXAS 77251–1443
mechanical data
Table 1 is designed to aid the user when referencing a device family to the mechanical data section. The table
shows a cross-reference of the device family to the TMS370 generic package names and the associated
mechanical drawing(s) by drawing number and name.
Table 1. TMS370 Family Package Type and Mechanical Cross-Reference
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á
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NJ formerly known as N2; the mechanical drawing of the NJ is identical to the N2 package and did not need to be requalified.
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(mil pin spacing)
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FZ – 28 pin
(50-mil pin spacing)
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(PLCC)
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CERAMIC LEADED CHIP CARRIER
(CLCC)
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á
á
á
á
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TMS370 GENERIC NAME
MECHANICAL NAME
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CHIP CARRIER
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FZ(S-CQCC-J**) J-LEADED CERAMIC
CHIP CARRIER
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á
á
á
á
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á
á
FN – 28 pin
á
á
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á
TMS370Cx0x,
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FN – 44 pin
(50-mil pin spacing)
á
PLASTIC LEADED CHIP CARRIER
(PLCC)
á
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á
á
á
á
(50-mil pin spacing)
á
PLASTIC LEADED CHIP CARRIER
(PLCC)
á
SE370Cx0x, SE370Cx1x,
and SE370CxCx
FN(S-PQCC-J**) PLASTIC J-LEADED
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(50-mil pin spacing)
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(CLCC)
(CLCC)
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CHIP CARRIER
CERAMIC LEADED CHIP CARRIER
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CHIP CARRIER
á
ááááá
ááááá
á
á
á
CERAMIC DUAL-IN-LINE PACKAGE
(CDIP)
á
JD(R-CDIP-T**) CERAMIC SIDE-BRAZE
DUAL-IN-LINE PACKAGE
CERAMIC LEADED CHIP CARRIER
á
SE370Cx1x and
SE370CxCx
á
JD – 28 pin
(100-mil pin spacing)
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(PDIP)
(CDIP)
á
PACKAGE
CERAMIC DUAL-IN-LINE PACKAGE
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DUAL-IN-LINE PACKAGE
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JD(R-CDIP-T**) CERAMIC SIDE-BRAZE
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TMS370CxCx
á
(100-mil pin spacing)
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(100-mil pin spacing)
á
PACKAGE (CSDIP)
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(PDIP)
á
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DUAL-IN-LINE PACKAGE
PLASTIC DUAL-IN-LINE PACKAGE
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PACKAGE
á
TMS370CxAx
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á
á
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á
PACKAGE (PSDIP)
á
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DUAL-IN-LINE PACKAGE
CERAMIC SHRINK DUAL-IN-LINE
á
á
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á
PACKAGE (CSDIP)
PACKAGE (PSDIP)
á
áááááááááá
DUAL-IN-LINE PACKAGE
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DUAL-IN-LINE PACKAGE
PLASTIC SHRINK DUAL-IN-LINE
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á
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ááááá
á
á
á
á
á
NM – 64 pin
á
á
NM(R-PDIP-T64) PLASTIC SHRINK
á
TMS370Cx5x,
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