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參數(shù)資料
| 型號： | SE5019N |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | DAC |
| 英文描述： | 8-Bit mp-compatible D/A converter |
| 中文描述： | PARALLEL, 8 BITS INPUT LOADING, 2.3 us SETTLING TIME, 8-BIT DAC, PDIP22 |
| 封裝： | 0.400 INCH, PLASTIC, DIP-22 |
| 文件頁數(shù)： | 2/6頁 |
| 文件大?。?/td> | 69K |
| 代理商： | SE5019N |
Philips Semiconductors Linear Products
Product specification
NE/SE5018/5019
8-Bit
μ
p-compatible D/A converter
August 31, 1994
752
BLOCK DIAGRAM
(13)
(12)
(20)
(18)
(21)
(22)
(14)
(15)OFFSET
V
REF
IN
ACOMP
GND
AMP
SUM
NODE
DAC CURRENT
OUTPUT
LATCHES AND
DAC SWITCHES
5k
5k
15k
(19)
(10)
LE
MSB
LSB
(1)
DGND
5k
V
CC+
INT
V
REF
(9)
(8)
(7)
(6)
(5)
(4)
(3)
(2)
V
CC–
(17)
(16)
V
OUT
5k
5k
+
–
+
–
+
–
DAC
V
OUT
V
ADJ
ABSOLUTE MAXIMUM RATINGS
SYMBOL
PARAMETER
RATING
UNIT
V
CC
+
V
CC
-
V
IN
V
REF IN
V
REF
ADJ
V
SUM
I
REF SC
I
OUTSC
P
D
Positive supply voltage
18
V
Negative supply voltage
-18
V
Logic input voltage
0 to 18
V
Voltage at V
REF
input
Voltage at V
REF
adjust
Voltage at sum node
12
V
0 to V
REF
12
V
V
Short-circuit current to ground at V
REF OUT
Short-circuit current to ground or either supply at V
OUT
Maximum power dissipation, T
A
=25
°
C (still-air)
1
F package
Continuous
Continuous
1740
mW
N package
2190
mW
D package
1600
mW
T
A
Operating temperature range
SE5018
-55 to +125
°
C
°
C
°
C
NE5018
0 to +70
T
STG
T
SOLD
Storage temperature range
-65 to +150
Lead soldering temperature
(10 seconds)
300
°
C
NOTES:
1. Derate above 25
°
C at the following rates:
F package at 13.9mW/
°
C
N package at 17.5mW/
°
C
D package at 12.8mW/
°
C
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