參數(shù)資料
型號: SE5532AD8G
廠商: ON Semiconductor
文件頁數(shù): 10/10頁
文件大小: 0K
描述: IC OPAMP DUAL LOW NOISE 8-SOIC
標準包裝: 98
放大器類型: 通用
電路數(shù): 2
轉換速率: 9 V/µs
增益帶寬積: 10MHz
電流 - 輸入偏壓: 200nA
電壓 - 輸入偏移: 500µV
電流 - 電源: 8mA
電流 - 輸出 / 通道: 38mA
電壓 - 電源,單路/雙路(±): ±3 V ~ 20 V
工作溫度: -55°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
供應商設備封裝: 8-SOICN
包裝: 管件
產(chǎn)品目錄頁面: 1131 (CN2011-ZH PDF)
其它名稱: SE5532AD8G-ND
SE5532AD8GOS
NE5532, SA5532, SE5532, NE5532A, SE5532A
http://onsemi.com
9
PACKAGE DIMENSIONS
8Pin Plastic Dual InLine Package (PDIP8)
N SUFFIX
CASE 62605
ISSUE N
14
5
8
b2
NOTE 8
D
b
L
A1
A
eB
E
A
TOP VIEW
C
SEATING
PLANE
0.010
CA
SIDE VIEW
END VIEW
WITH LEADS CONSTRAINED
DIM
MIN
MAX
INCHES
A
0.210
A1
0.015
b
0.014
0.022
C
0.008
0.014
D
0.355
0.400
D1
0.005
e
0.100 BSC
E
0.300
0.325
M
10
5.33
0.38
0.35
0.56
0.20
0.36
9.02
10.16
0.13
2.54 BSC
7.62
8.26
10
MIN
MAX
MILLIMETERS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-
AGE SEATED IN JEDEC SEATING PLANE GAUGE GS3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE NOT
TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
6. DIMENSION E3 IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
E1
0.240
0.280
6.10
7.11
b2
eB
0.430
10.92
0.060 TYP
1.52 TYP
E1
M
8X
c
D1
B
A2
0.115
0.195
2.92
4.95
L
0.115
0.150
2.92
3.81
°
H
NOTE 5
e
e/2
A2
NOTE 3
M
B M
NOTE 6
M
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