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參數(shù)資料
| 型號： | SFC05-4 |
| 廠商： | Semtech Corporation |
| 英文描述： | CSP TVS Flip Chip TVS Diode Array |
| 中文描述： | 總警司二極管倒裝芯片抑制二極管陣列 |
| 文件頁數(shù)： | 3/5頁 |
| 文件大?。?/td> | 239K |
| 代理商： | SFC05-4 |
3
www.protekdevices.com
05130.R6 8/03
SFC05-5
GRAPHS
0 5 10 15 20
V
C
0
4
8
12
14
FIGURE 6
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR SFC05-5
10
6
2
I
PP
- Peak Pulse Current - Amps
225°C
5-10 sec
Instantaneous
to 200°C
Soldering
Time
Cool Down
Time
1-2 Minutes
to 150°C
1-2 Minutes to 25°C
Pre-Heat
Time
100°C
200°C
Note:
This reflow profile does not take into account the printed circuit board (PCB) material
heating time. Additional time may be required for the preheat time and cool down time upon the
PCB or board material.
0 25 50 75 100 125 150
T
L
- Lead Temperature - °C
20
40
60
80
100
%
Peak Pulse Power
8/20μs
Average Power
FIGURE 3
POWER DERATING CURVE
0
FIGURE 4
REFLOW SOLDER PROFILE
ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)
FIGURE 5
OVERSHOOT & CLAMPING VOLTAGE FOR SFC05-5
5
-5
5
15
25
35
相關(guān)PDF資料 |
PDF描述 |
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| SFC05-4TM | CSP TVS Flip Chip TVS Diode Array |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SFC05-4.TC | 制造商:Semtech Corporation 功能描述: |
| SFC05-4.TM | 制造商:Semtech Corporation 功能描述: |
| SFC05-4.WC | 制造商:SEMTECH 制造商全稱:Semtech Corporation 功能描述:ChipClampΤΜ Flip Chip TVS Diode Array |
| SFC05-4.WCT | 制造商:SEMTECH 制造商全稱:Semtech Corporation 功能描述:ChipClampΤΜ Flip Chip TVS Diode Array |
| SFC05-4_04 | 制造商:SEMTECH 制造商全稱:Semtech Corporation 功能描述:ChipClampΤΜ Flip Chip TVS Diode Array |
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