參數(shù)資料
型號: SG-5A03L
元件分類: 繼電器,輸入/輸出模塊
英文描述: TRIGGER OUTPUT SOLID STATE RELAY, 2500 V ISOLATION-MAX
封裝: 40 X 9 MM, 20 MM HEIGHT, ROHS COMPLIANT PACKAGE-4
文件頁數(shù): 5/6頁
文件大?。?/td> 364K
代理商: SG-5A03L
SG SERIES
5
1. General Information
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Relaysproducedafterthespecificdatecodethatisindicatedoneachdatasheetarelead-free
now.Mostofoursignalandpowerrelaysarelead-free.PleaserefertoLead-FreeStatusInfo.
(http://www.fujitsu.com/us/downloads/MICRO/fcai/relays/lead-free-letter.pdf)
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LeadfreesolderpastecurrentlyusedinrelaysisSn-3.0Ag-0.5Cu.
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AllsignalandmostpowerrelaysalsocomplywithRoHS.Pleaserefertoindividualdata
sheets.RelaysthatareRoHScompliantdonotcontainthe5hazardousmaterialsthat
arerestrictedbyRoHSdirective(lead,mercury,chromiumIV,PBB,PBDE).
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Ithasbeenverifiedthatusinglead-freerelaysinleadedassemblyprocesswillnotcauseany
problems(compatible).
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“LF”ismarkedoneachouterandinnercarton.(Nomarkingonindividualrelays).
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Toavoidleadedrelays(forlead-freesample,etc.)pleaseconsultwithareasalesoffice.
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Wewillshipleadedrelaysaslongastheleadedrelayinventoryexists.
Note:CadmiumwasexemptedfromRoHSonOctober21,2005.(AmendmenttoDirective2002/95/EC)
2. Recommended Lead Free Solder Profile
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RecommendedsolderpasteSn-3.0Ag-0.5Cu.
RoHS Compliance and Lead Free Relay Information
Reflow Solder condition
3. Moisture Sensitivity
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MoistureSensitivityLevelstandardisnotapplicabletoelectromechanicalrealys.
4. Tin Whisker
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DippedSnAgCusolderisknownaslowrisktinwhisker.Noconsiderablelengthwhiskerwasfoundbyourin
housetest.
We highly recommend that you confirm your actual solder conditions
Flow Solder condition:
Pre-heating:
maximum120C
Soldering:
dipwithin5sec.at
260Csolerbath
Solder by Soldering Iron:
SolderingIron
Temperature: maximum360C
Duration:
maximum3sec.
相關(guān)PDF資料
PDF描述
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