參數(shù)資料
型號(hào)： SG120-18IG
廠商： MICROSEMI CORP-ANALOG MIXED SIGNAL GROUP
元件分類： 基準(zhǔn)電壓源/電流源
英文描述： NEGATIVE FIXED VOLTAGE REGULATOR
中文描述： 18 V FIXED NEGATIVE REGULATOR, MSFM3
封裝： TO-257, TO-220, 3 PIN
文件頁(yè)數(shù)： 2/8頁(yè)
文件大?。?/td> 167K
代理商： SG120-18IG
SG120
11/91 Rev 1.4 6/97
Copyright
1997
L
IN
F
IN
ITY
Microelectronics Inc.
Garden
Grove,
FAX: (714) 893-2570
11861 Western Avenue
∞
CA
92841
2
(714) 898-8121
∞
ABSOLUTE MAXIMUM RATINGS
(Note 1)
NEGATIVE REGULATOR
-65
°
C to 150
°
C
300
°
C
Operating Junction Temperature
Hermetic (K, R, IG - Packages) ...................................
Storage Temperature Range ...........................
Lead Temperature (Soldering, 10 Seconds) .................
FIGURE 1.
MAXIMUM AVERAGE POWER DISSIPATION
FIGURE 2.
QUIESCENT CURRENT VS. LOAD
FIGURE 3.
TEMPERATURE COEFFICIENT
Device
Input Voltage Differential
(Output shorted to ground)
35V
35V
35V
35V
35V
35V
35V
Output Voltage
-5V
-5.2V
-8V
-12V
-15V
-18V
-20V
Input Voltage
-35V
-35V
-35V
-35V
-40V
-40V
-40V
150
°
C
Note 1. Values beyond which damage may occur.
Operating Junction Temperature Range:
SG120 ...........................................................
RECOMMENDED OPERATING CONDITIONS
(Note 2)
CHARACTERISTIC CURVES
-55
°
C to 150
°
C
Note 2. Range over which the device is functional.
THERMAL DATA
K Package:
Thermal Resistance-
Junction to Case
,
θ
JC
................. 3.0°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
............... 35°C/W
R Package:
Thermal Resistance-
Junction to Case
,
θ
JC
................. 5.0°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
.............. 40°C/W
T Package:
Thermal Resistance-
Junction to Case
,
θ
JC
.................. 15°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
............ 120°C/W
IG Package:
Thermal Resistance-
Junction to Case
,
θ
JC
................. 3.5°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
.............. 42°C/W
L Package:
Thermal Resistance-
Junction to Case
,
θ
JC
.................. 35°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
............ 120°C/W
Note A. Junction Temperature Calculation: T
= T
+ (P
x
θ
).
Note B. The above numbers for
θ
are maximums for the limiting thermal
resistance of the package in a standard mounting configuration.
The
θ
numbers are meant to be guidelines for the thermal
performance of the device/pc-board system. All of the above
assume no ambient airflow.
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