參數(shù)資料
型號(hào): SG140-35T
廠商: Microsemi Corporation
英文描述: positve fixed voltage regulator
中文描述: positve固定電壓調(diào)節(jié)器
文件頁(yè)數(shù): 2/9頁(yè)
文件大?。?/td> 208K
代理商: SG140-35T
2/90 Rev 1.4 6/97
Copyright
1997
2
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ABSOLUTE MAXIMUM RATINGS
(Note 1)
Device
Output Voltage
5V
6V
8V
12V
15V
18V
24V
Input Voltage
(transient)
(Note 3)
50V
50V
50V
50V
50V
50V
50V
Input Voltage Differential
(Output shorted to ground)
35V
35V
35V
35V
35V
35V
35V
Input Voltage
35V
35V
35V
35V
35V
35V
40V
Operating Junction Temperature
Hermetic (K, R, IG - Packages) ................................... 150
°
C
Storage Temperature Range ............................
Lead Temperature (Soldering, 10 Seconds) ...................
-65
°
C to 150
°
C
300
°
C
FIGURE 1.
PEAK OUTPUT CURRENT
VS. INPUT - OUTPUT DIFFERENTIAL
Note 3. Operation at high input voltages is dependent upon load current. When
load current is less than 5mA, output will rise out of regulation as input-
oiutput differential icreases beyond 30V. Note also from Figure 1, that
maximum load current is reduced at high voltages. The 50V input rating
of the SG140A series refers to ability to withstnd high line or transient
conditions without damage. Since the regulator's maximum current
capability is reduced, the output may fall out of regulation at high input
voltages under nominal loading.
Note 1. Values beyond which damage may occur.
-55
°
C to 150
°
C
Operating Junction Temperature Range:
SG140A/140 ..................................................
RECOMMENDED OPERATING CONDITIONS
(Note 2)
Note 2. Range over which the device is functional.
CHARACTERISTIC CURVES
THERMAL DATA
K Package:
Thermal Resistance-
Junction to Case
,
θ
JC
................. 3.0°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
............... 35°C/W
R Package:
Thermal Resistance-
Junction to Case
,
θ
JC
................. 5.0°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
.............. 40°C/W
T Package:
Thermal Resistance-
Junction to Case
,
θ
JC
.................. 15°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
............ 120°C/W
IG Package:
Thermal Resistance-
Junction to Case
,
θ
JC
................. 3.5°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
.............. 42°C/W
L Package:
Thermal Resistance-
Junction to Case
,
θ
JC
.................. 35°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
............ 120°C/W
Note A. Junction Temperature Calculation: T
= T
+ (P
x
θ
).
Note B. The above numbers for
θ
are maximums for the limiting
thermal resistance of the package in a standard mounting
configuration. The
θ
numbers are meant to be guide-
lines for the thermal performance of the device/pc-board
system. All of the above assume no ambient airflow.
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