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| 型號(hào)： | SG1844Y |
| 廠商： | MICROSEMI CORP-ANALOG MIXED SIGNAL GROUP |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | CURRENT MODE PWM CONTROLLER |
| 中文描述： | 1 A SWITCHING CONTROLLER, 500 kHz SWITCHING FREQ-MAX, CDIP8 |
| 封裝： | HERMETIC SEALED, CERAMIC, DIP-8 |
| 文件頁(yè)數(shù)： | 2/12頁(yè) |
| 文件大小： | 216K |
| 代理商： | SG1844Y |
C
U R R E N T
-M
O D E
PWM C
O N T R O L L E R
SG1844/SG1845 Series
P R O D U C T D A T A B O O K 1 9 9 6 / 1 9 9 7
Copyright 2000
Rev. 1.4 4/00
2
P
R O D U C T I O N
D
A T A
S
H E E T
ABSOLUTE MAXIMUM RATINGS
(Notes 1 & 2)
Supply Voltage (I
< 30mA) ...............................................................Self Limiting
Supply Voltage (Low Impedance Source) ........................................................30V
Output Current (Peak) .......................................................................................±1A
Output Current (Continuous) .......................................................................350mA
Output Energy (Capacitive Load).......................................................................5μJ
Analog Inputs (Pins 2, 3) ................................................................. -0.3V to +6.3V
Error Amp Output Sink Current .....................................................................10mA
Operating Junction Temperature
Hermetic (J, Y, F, L Packages)................................................................... 150°C
Plastic (N, M, D, DM Packages) ................................................................ 150°C
Storage Temperature Range.......................................................... -65°C to +150°C
Lead Temperature (Soldering, 10 Seconds).................................................. 300°C
PACKAGE PIN OUTS
V
REF
V
CC
OUT UT
GND
COM
V
FB
I
SENSE
R
T
/C
T
1
8
2
7
3
6
4
5
M & Y PACKAGE
(Top View)
DM PACKAGE
(Top View)
V
REF
V
CC
OUT UT
GND
COM
V
FB
I
SENSE
R
T
/C
T
1
8
2
7
3
6
4
5
V
REF
N.C.
V
CC
V
C
OUT UT
GND
WR GND
COM
N.C.
V
FB
N.C.
I
SENSE
N.C.
R
T
/C
T
1
14
2
13
3
12
4
11
5
10
6
9
7
8
D PACKAGE
(Top View)
M PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
N PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
DM PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
D PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
Y PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
J PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
F PACKAGE:
THERMAL RESISTANCE-JUNCTION TO CASE,
θ
JC
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
L PACKAGE:
THERMAL RESISTANCE-JUNCTION TO CASE,
θ
JC
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
95°C/W
65°C/W
165°C/W
120°C/W
130°C/W
80°C/W
80°C/W
145°C/W
35°C/W
120°C/W
Junction Temperature Calculation: T
= T
+ (P
x
θ
).
The
θ
numbers are guidelines for the thermal performance of the device/pc-board
system. All of the above assume no ambient airflow.
THERMAL DATA
Note 1. Exceeding these ratings could cause damage to the device.
Note 2. All voltages are with respect to Pin 5. All currents are positive into the specified
terminal.
1
14
2
13
3
12
4
11
5
10
6
9
7
8
J & N PACKAGE
(Top View)
COM
N.C.
V
FB
N.C.
I
SENSE
N.C.
R
T
/C
T
V
REF
N.C.
V
CC
V
C
OUT UT
GROUND
OWER GND
F PACKAGE
(Top View)
10.V
REF
9. V
CC
8. V
C
7. OUT UT
6. GND
1. COM
2. V
FB
3. I
SENSE
4. R
T
/C
T
5. OWER GND
1
2
3
4
5
10
9
8
7
6
L PACKAGE
(Top View)
3
2
4
5
6
7
8
9
11
10
1. N.C.
2. N.C.
3. COM .
4. N.C.
5. V
FB
6. N.C.
7. I
SENSE
8. R
T
/C
T
9. N.C.
10. N.C.
1
20 19
18
17
16
15
14
12 13
11. N.C.
12.
13. GND
14. N.C.
15. OUT UT
16. N.C.
17. V
C
18. V
CC
19. N.C.
20. V
REF
WR GND
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