SG117A/SG117 SERIES
2/93 Rev 1.1 2/94
Copyright
1994
L
IN
F
IN
ITY
Microelectronics Inc.
11861 Western Avenue
∞
∞
Garden Grove, CA 92841
(714) 898-8121
∞
FAX: (714) 893-2570
2
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, these specifications apply over full operating ambient temperatures for SG117A/SG117 with -55°C
≤
T
≤
125°C, SG217A/
SG217 with -25°C
≤
T
≤
150°C, SG 317A/SG317 with 0°C
≤
T
≤
125°C, V
- V
= 5.0V , and for I
= 500mA (K, R, and IG), and I
= 100mA
(T and L packages). Although power dissipation is internally limited, these specifications are applicable for power dissipations of 2W for the T and L
packages, and 20W for the K, R, and IG packages. I
is 1.5A for the K, R, and IG packages and 500mA for the T and L packages. Low duty cycle
pulse testing techniques are used which maintains junction and case temperatures equal to the ambient temperature.)
Power Dissipation ........................................
Input to Output Voltage Differential .................................
Storage Temperature Range ..........................
Note 1. Exceeding these ratings could cause damage to the device.
ABSOLUTE MAXIMUM RATINGS
(Note 1)
Internally Limited
40V
-65
°
C to 150
°
C
Operating Junction Temperature
Hermetic (K, R, T, L, IG-Packages) ............................
Lead Temperature (Soldering, 10 Seconds) ..............
150
°
C
300
°
C
Input Voltage Range ..............................
(V
OUT
+ 3.5V) to 37V
Operating Junction Temperature Range
SG117A/SG117 .........................................
SG217A/SG217 .........................................
SG317A/SG317 ............................................
-55°C to 150°C
-25°C to 150°C
0°C to 125°C
Note 2. Range over which the device is functional.
Note 3. These ratings are applicable for junction temperatures of less than 150°C.
RECOMMENDED OPERATING CONDITIONS
(Note 2 & 3)
Units
SG117/SG217
Min.
Typ. Max.
Min.
1.238
Typ. Max.
1.250
SG117A/SG217A
Parameter
Test Conditions
I
= 10mA T
A
= 25°C
3V
≤
(V
IN
- V
OUT
)
≤
40V, P
≤
P
MAX
,
10mA
≤
I
≤
I
MAX
3V
≤
(V
- V
OUT
)
40V, I
L
= 10mA
T
A
= 25°C
T
= T
MIN
to T
MAX
10mA
≤
≤
V
OUT
≤
5V, T
A
= 25°C
V
OUT
≥
5V, T
A
= 25°C
V
OUT
≤
5V
V
≥
5V
T
A
= 25°C, 20ms pulse
V
OUT
= 10V, f =120Hz
C
ADJ
= 1
μ
F, T
A
= 25°C
C
ADJ
= 10
μ
F
10mA
≤
I
OUT
≤
I
MAX
, 2.5V
≤
(V
IN
- V
OUT
)
≤
40V
1.225
66
1.250
0.005
0.01
5
0.1
20
0.3
0.002
65
80
50
0.2
1.262
1.270
0.01
0.02
15
0.3
50
1
0.02
100
5
1.20
66
1.25
0.01
0.02
5
0.1
20
0.3
0.03
65
80
50
0.2
1.30
0.02
0.05
15
0.3
50
1
0.07
100
5
V
V
%/V
%/V
mV
%
mV
%
%/W
dB
dB
μA
μA
K Package:
Thermal Resistance-
Junction to Case
,
θ
JC
................. 3.0°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
.............. 35°C/W
R Package:
Thermal Resistance-
Junction to Case
,
θ
JC
................. 5.0°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
............. 40°C/W
T Package:
Thermal Resistance-
Junction to Case
,
θ
JC
.................. 15°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
........... 120°C/W
IG Package:
Thermal Resistance-
Junction to Case
,
θ
JC
................. 3.5°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
............. 42°C/W
L Package:
Thermal Resistance-
Junction to Case
,
θ
JC
.................. 35°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
........... 120°C/W
THERMAL DATA
Note A. Junction Temperature Calculation: T
= T
+ (P
x
θ
).
Note B. The above numbers for
θ
are maximums for the limiting
thermal resistance of the package in a standard mount-
ing configuration. The
θ
numbers are meant to be
guidelines for the thermal performance of the device/pc-
board system. All of the above assume no ambient
airflow.
Reference Voltage
Line Regulation
(Note 4)
Load Regulation
(Note 4)
Thermal Regulation
(Note 5)
Ripple Rejection
Adjust Pin Current
Adjust Pin Current Change