參數(shù)資料
型號(hào): SG337
廠商: Microsemi Corporation
英文描述: 1.5 AMP NEGATIVE ADJUSTABLE REGULATOR
中文描述: 1.5放大器的負(fù)調(diào)節(jié)調(diào)壓器
文件頁(yè)數(shù): 2/6頁(yè)
文件大小: 110K
代理商: SG337
SG137A/SG137 SERIES
2/92 Rev 1.1 2/94
Copyright
1994
L
IN
F
IN
ITY
Microelectronics Inc.
11861 Western Avenue
Garden Grove, CA 92841
(714) 898-8121
FAX: (714) 893-2570
2
Power Dissipation ..........................................
Input to Output Voltage Differential ....................................
Storage Temperature Range ............................
ABSOLUTE MAXIMUM RATINGS
(Note 1)
Internally Limited
40V
-65
°
C to 150
°
C
Operating Junction Temperature
Hermetic (K, R, T, L, IG-Packages) ...........................
Lead Temperature (Soldering, 10 Seconds) .............
150
°
C
300
°
C
Note 1. Exceeding these ratings could cause damage to the device.
RECOMMENDED OPERATING CONDITIONS
(Note 2 & 3)
Input Voltage Range ..............................-(V
OUT
+ 3.5V) to -36V
Operating Junction Temperature Range
SG137A/SG137 ............................................
SG237A/SG237 ............................................
SG337A/SG337 .............................................
-55°C to 150°C
-25°C to 150°C
0°C to 125°C
Note 2. Range over which the device is functional.
Note 3. These ratings are applicable for junction temperatures of less than 135°C.
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, these specifications apply over full operating ambient temperatures for SG137A/SG137 with -55°C
T
150°C, SG237A/
SG237 with -25°C
T
150°C, SG337A/SG337 with 0°C
T
125°C, |V
- V
| = 5.0V, and for I
= 500mA (K, R, and IG power packages) and I
= 100mA (T and L packages). Although power dissipation is internally limited, these specifications are applicable for power dissipations of 2
for the T and
L packages, and 20
for the K, R, and IG packages. I
is 1.5A for the K, R, and IG packages and 0.5A for the T and L packages. Low duty cycle pulse
testing techniques are used which maintains junction and case temperatures equal to the ambient temperature.)
THERMAL DATA
K Package:
Thermal Resistance-
Junction to Leads
,
θ
JC
................ 3.0°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
............... 35°C/W
R Package:
Thermal Resistance-
Junction to Leads
,
θ
JC
................ 5.0°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
.............. 40°C/W
T Package:
Thermal Resistance-
Junction to Leads
,
θ
JC
................. 15°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
............ 120°C/W
IG Package:
Thermal Resistance-
Junction to Leads
,
θ
JC
................ 3.5°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
.............. 42°C/W
L Package:
Thermal Resistance-
Junction to Leads
,
θ
JC
................. 35°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
............ 120°C/W
Units
SG137/SG237
Min.
Typ. Max.
-1.225
-1.200
-1.250
Min.
-1.238
-1.220
Typ. Max.
-1.250
-1.250
SG137A/SG237A
Parameter
Test Conditions
I
= 10mA, T
A
= 25°C
3V
|V
IN
- V
OUT
|
40V, 10mA
I
OUT
I
MAX
3V
|V
- V
OUT
|
40V, I
OUT
I
MAX
T
= 25°C
10mA
I
I
|V
OUT
|
5V, T
A
= 25°C
|V
OUT
|
5V, T
A
= 25°C
|V
OUT
|
5V
|V
|
5V
T
A
= 25°C, 10ms pulse
V
OUT
= -10V, f =120Hz
C
ADJ
= 0, T
A
= 25°C
C
= 10
μ
F
T
= 25°C
3V
|V
IN
- V
OUT
|
40V
10mA
I
OUT
I
MAX
Reference Voltage
(Note 6)
Line Regulation
(Note 4, 6)
Load Regulation
(Note 4)
Thermal Regulation
(Note 5)
Ripple Rejection
Adjust Pin Current
Adjust Pin Current Change
(Note 6)
60
70
0.005
5
0.1
10
0.2
0.002
66
80
65
1.0
0.2
-1.262
-1.280
0.01
25
0.5
50
1.0
0.02
100
5
2
66
-1.250
0.01
15
0.3
20
0.3
0.002
60
77
65
2
0.5
-1.275
-1.300
0.02
25
0.5
50
1.0
0.02
100
5
5
V
V
%/V
mV
%
mV
%
%/W
dB
dB
μ
A
μ
A
μ
A
Note A. Junction Temperature Calculation: T
= T
+ (P
x
θ
).
Note B. The above numbers for
θ
are maximums for the limiting
thermal resistance of the package in a standard mount-
ing configuration. The
θ
numbers are meant to be
guidelines for the thermal performance of the device/pc-
board system. All of the above assume no ambient
airflow.
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