參數(shù)資料
型號(hào): SG3635P
廠商: MICROSEMI CORP-ANALOG MIXED SIGNAL GROUP
元件分類: 外設(shè)及接口
英文描述: 2A, HALF-BRIDGE DRIVER
中文描述: 5 A HALF BRIDGE BASED PRPHL DRVR, PSFM5
封裝: ROHS COMPLIANT, PLASTIC, TO-220, 5 PIN
文件頁(yè)數(shù): 2/5頁(yè)
文件大小: 49K
代理商: SG3635P
SG1635/SG3635
6/91 Rev 1.1 2/94
Copyright
1994
L
IN
F
IN
ITY
Microelectronics Inc.
11861 Western Avenue
Garden Grove, CA 92841
(714) 898-8121
FAX: (714) 893-2570
2
ABSOLUTE MAXIMUM RATINGS
(Note 1)
Supply Voltage (V
)
SG1635/SG3635 ............................................................. 40V
Input Voltage
Enable and Pulse .............................................................. 7V
Source/Sink Output Current
Contiuous........................................................................... 3A
Peak................................................................................... 5A
Operating Junction Temperature
Hermetic (R - Package)............................................... 150°C
Plastic (P - Package)................................................... 150°C
Storage Temperature Range ............................ -65°C to 150°C
Lead Temperature (Soldering, 10 Seconds) .................. 300°C
Supply Voltage (V
)
SG1635/SG3635 .................................................... 8V to 35V
Source/Sink Output Current
Continuous......................................................................... 2A
Peak................................................................................... 3A
Operating Ambient Temperature Range
SG1635...........................................................-55°C to 125°C
SG3635................................................................0°C to 70°C
Note 2. Range over which the device is functiona
l.
RECOMMENDED OPERATING CONDITIONS
(Note 2)
ELECTRICAL CHARACTERISTICS
SG1635/SG3635
Min.
Typ. Max.
Parameter
Test Conditions
SG1635 and SG3635
(Unless otherwise specified, these specfiications apply over the operating ambient temperatures for SG1635 with -55
°
C
T
125
°
C, SG3635 with
0
°
C
T
70
°
C, and +V
S
= 24V. Low duty cycle pulse testing techniques are used which maintains junction and case temperatures equal to the ambient
temperature.)
V
PULSE
= V
ENABLE
= 4.5V
V
PULSE
= V
ENABLE
= 0V
V
PULSE
= V
= 2.0V
V
OUT
= 24V
V
OUT
= 0V
V
PULSE
= 2.0V, V
ENABLE
= 0.8V, I
OUT
= -2A
V
PULSE
= 0.8V, V
ENABLE
= 2.0V, I
OUT
= 2A
I
DIODE
=
±
2A
V
S
V
PULSE
= 2.0V, V
ENABLE
= 0.8V
V
PULSE
= 0.8V, V
ENABLE
= 2.0V
Logic 1 Input Voltage
Logic 0 Input Voltage
Input High Current
Input Low Current
Output Leakage
Source Saturation Voltage
Sink Saturation Voltage
Diode Forward Voltage
Supply Current
Static Characteristics
2.0
V
V
μ
A
mA
mA
mA
V
V
V
mA
mA
2.0
2.0
2.0
Units
0.8
200
-3.2
500
40
3.0
3.0
3.0
25
70
Note 1. Values beyond which damage may occur.
*
=
θ
JT
(Junction to Tab)
THERMAL DATA
R Package:
Thermal Resistance-
Junction to Case
,
θ
JC
................. 5.0°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
.............. 40°C/W
P Package:
Thermal Resistance-
Junction to Case
,
θ
JT
................ 4.0°C/W
*
Thermal Resistance-
Junction to Ambient
,
θ
JA
............. 55°C/W
Note A. Junction Temperature Calculation: T
= T
+ (P
x
θ
).
Note B. The above numbers for
θ
are maximums for the limiting
thermal resistance of the package in a standard mount-
ing configuration. The
θ
numbers are meant to be
guidelines for the thermal performance of the device/pc-
board system. All of the above assume no ambient
airflow.
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