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| 型號(hào)： | SG55454BL |
| 廠商： | Microsemi Corporation |
| 英文描述： | DUAL PERIPHERAL POSITIVE NOR DRIVER |
| 中文描述： | 雙周圍積極的，也不驅(qū)動(dòng) |
| 文件頁數(shù)： | 2/3頁 |
| 文件大?。?/td> | 39K |
| 代理商： | SG55454BL |
SG55451B/61/71 SERIES
5/92 Rev 1.1 2/94
Copyright
1994
L
IN
F
IN
ITY
Microelectronics Inc.
11861 Western Avenue
∞
∞
Garden Grove, CA 92841
(714) 898-8121
∞
FAX: (714) 893-2570
2
Supply Voltage (V
) ............................................................
Input Voltage .....................................................................
Interemitter Voltage
...........................................................
Off-state Output Voltage
X5451B Series ................................................................
X5461 Series ..................................................................
X5471 Series ..................................................................
7V
5.5V
5.5V
30V
35V
70V
ABSOLUTE MAXIMUM RATINGS
(Note 1)
Output Current .............................................................
Continuous Total Dissipation at (or below)
25°C Free-Air Temperature .....................................
Operating Junction Temperature
Hermetic (Y, L Packages) ..........................................
Storage Temperature Range ..........................
Lead Temperature (1/16 inch from case
for soldering 60 sec.) .................................................
400mA
800mW
150
°
C
-65
°
C to 150
°
C
300
°
C
Note 1. Exceeding these ratings could cause damage to the device.
THERMAL DATA
Y Package:
Thermal Resistance-
Junction to Case
,
θ
JC
.................. 50°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
............ 130°C/W
L Package:
Thermal Resistance-
Junction to Case
,
θ
JC
.................. 35°C/W
Thermal Resistance-
Junction to Ambient
,
θ
JA
............ 120°C/W
Note A. Junction Temperature Calculation: T
= T
+ (P
x
θ
).
Note B. The above numbers for
θ
are maximums for the limiting
thermal resistance of the package in a standard mount-
ing configuration. The
θ
numbers are meant to be
guidelines for the thermal performance of the device/pc-
board system. All of the above assume no ambient
airflow.
Min. Typ. Max. Min. Typ. Max.
2
SG55451B
SG55461
SG55471
SG75451B
SG75461
SG75471
Test Conditions
Parameter
Units
-1.2
0.25
0.5
-1.0
8
52
56
56
0.8
-1.5
300
0.5
0.8
1.0
60
-1.6
11
65
76
76
-1.2
0.25
0.5
-1.0
8
52
56
56
High-level Input Voltage (V
IH
)
Low-level Input Voltage (V
IL
)
Input Clamp Voltage (V
)
High-level Output Current (I
OH
)
Low-level Output Voltage (V
OL
)
Input Current at Max V
(I
IN
)
High-level Input Current (I
IH
)
Low-level Input Current (I
)
Supply Current, Outputs High
Supply Current, Outputs Low
V
V
V
μ
A
V
V
mA
μ
A
mA
mA
mA
mA
mA
0.8
-1.5
100
0.4
0.7
1.0
60
-1.6
11
65
76
76
2
V
CC
= MIN, I
IN
= -12mA
V
CC
= MIN, V
= 2V,
V
OH
= 30V SGX5451B
V
OH
= 35V SGX5461
V
= 70V SGX5471
V
CC
= MIN, V
IL
= 0.8V, I
OL
= 100mA
V
CC
= MIN, V
IL
= 0.8V, I
OL
= 300mA
V
CC
= MAX, V
IN
= 5.5V
V
CC
= MAX, V
IN
= 2.4V
V
CC
= MAX, V
IN
= 0.4V
V
CC
= MAX, V
IN
= 5V
V
CC
= MAX, V
IN
= 0V
SGX5451B
SGX5461
SGX5471
4.5V to 5.5V
4.75V to 5.25V
Supply Voltage (V
)
SG55451B, SG55461, SG55471 .......................
SG75451B, SG75461, SG75471 ...................
Note 2. Range over which device is functional.
Note 3. The substrate (pin 8) must always be at the most-negative device voltage for proper operation.
Operating Ambient Temperature Range
SG55451B, SG55461, SG55471 ...................
SG75451B, SG75461, SG75471 ........................
-55
°
C to 125
°
C
0
°
C to 70
°
C
RECOMMENDED OPERATING CONDITIONS
(Notes 2 & 3)
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, these specifications apply over the operating ambient temperatures for SG55451B/461/471 with -55
°
C
≤
T
≤
125
°
C, and
SG75451B/461/471 with 0
°
C
≤
T
≤
70
°
C. Typical values are tested at V
= 5V, and T
A
= 25
°
C. Low duty cycle pulse testing techniques are used
which maintains junction and case temperatures equal to the ambient temperature.)
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